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Author:

Ren, Yanlin (Ren, Yanlin.) | Liu, Zhaomiao (Liu, Zhaomiao.) (Scholars:刘赵淼) | Pang, Yan (Pang, Yan.) | Wang, Xiang (Wang, Xiang.) | Xu, Yuandi (Xu, Yuandi.)

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EI Scopus SCIE

Abstract:

The metal droplets deposition method (MDDM) is a rapid prototyping technology, implemented via metallurgy bonding within droplets. The anisotropy of heat transfer and re-melting is caused by an asymmetric deposition process. A lattice Boltzmann method (LBM) model is established to predict the heat transfer and phase change in the multi-layer deposition. The prediction model is verified by the experimental temperature profiles in existing literature. The monitoring points are set to compare the temperature profiles, and decoupling analyze the heat transfer mechanism in different positions. The negative relationships between the re-molten volume of the temperature difference, as well as the influence of the dispositive position and the relative position of the adjacent component are observed and analyzed under the heat conduction. This work is helpful to choose the appropriate temperature conditions and the optimal dispositive method. © 2021, Shanghai University and Springer-Verlag GmbH Germany, part of Springer Nature.

Keyword:

Predictive analytics Deposition Temperature control Drop formation Heat conduction

Author Community:

  • [ 1 ] [Ren, Yanlin]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [Liu, Zhaomiao]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [Liu, Zhaomiao]Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 4 ] [Pang, Yan]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 5 ] [Pang, Yan]Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 6 ] [Wang, Xiang]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 7 ] [Xu, Yuandi]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China

Reprint Author's Address:

  • 刘赵淼

    [liu, zhaomiao]beijing key laboratory of advanced manufacturing technology, beijing university of technology, beijing; 100124, china;;[liu, zhaomiao]college of mechanical engineering and applied electronics technology, beijing university of technology, beijing; 100124, china

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Source :

Applied Mathematics and Mechanics (English Edition)

ISSN: 0253-4827

Year: 2021

Issue: 4

Volume: 42

Page: 553-566

4 . 4 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:87

JCR Journal Grade:1

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 6

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 7

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