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Author:

Dai, Yanwei (Dai, Yanwei.) (Scholars:代岩伟) | Qin, Fei (Qin, Fei.) (Scholars:秦飞) | Liu, Yinghua (Liu, Yinghua.) | Chao, Yuh J. (Chao, Yuh J..)

Indexed by:

EI Scopus SCIE

Abstract:

A two-order asymptotic solution for sharp V-notch tip mechanics field in elasto-viscoplastic solids with power-law form under mode I loading is developed. The stress exponents and angular distributions for various notch angles and viscoplastic exponents for the second terms are reported. The stress exponent of the first order is singular and is non-singular except for low creep exponent with small notch opening angle. Compared with finite element results from several V-notched specimens, it is found that the two-order solution can have a better estimate for those cases with small notch opening angles, e.g., α = 30° under n = 5, than that of one-order solution regardless of viscoplastic extent, specimen type and loading level. One-order term solution is demonstrated to be sufficient to characterize the full field of sharp V-notch specimen for those conditions that elastic term is considered into higher order term, e.g., α = 60° under n = 5, in all specimens under various viscoplasticity extents. © 2021 Elsevier Ltd

Keyword:

Plasticity Asymptotic analysis Stress analysis Viscoplasticity

Author Community:

  • [ 1 ] [Dai, Yanwei]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [Dai, Yanwei]Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [Qin, Fei]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 4 ] [Qin, Fei]Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 5 ] [Liu, Yinghua]Department of Engineering Mechanics, AML, Tsinghua University, Beijing; 100084, China
  • [ 6 ] [Chao, Yuh J.]University of South Carolina, 300 Main Street, Room A123, Columbia; SC; 29208, United States

Reprint Author's Address:

  • 代岩伟

    [dai, yanwei]institute of electronics packaging technology and reliability, faculty of materials and manufacturing, beijing university of technology, beijing; 100124, china;;[dai, yanwei]beijing key laboratory of advanced manufacturing technology, beijing university of technology, beijing; 100124, china

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Source :

International Journal of Solids and Structures

ISSN: 0020-7683

Year: 2021

Volume: 217-218

Page: 106-122

3 . 6 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:87

JCR Journal Grade:2

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 10

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 3

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