Vibration lifetime modelling of PBGA solder joints under random vibration loading - Details

Author：

Qin, Fei (Qin, Fei.) (Scholars：秦飞) | Bie, Xiaorui (Bie, Xiaorui.) | Chen, Si (Chen, Si.) | An, Tong (An, Tong.)

Indexed by：

EI Scopus CSCD

Abstract：

The　sinusoidal　and　random　vibration　tests　of　Sn37Pb　soldered　plastic　ball　grid　array　(PBGA)　assemblies　were　conducted　to　obtain　the　vibration　lifetime　of　solder　joints.　A　finite　element　analysis　(FEA)　was　performed　to　obtain　the　maximum　stresses　at　critical　solder　joints.　A　method　was　proposed　for　the　vibration　lifetime　prediction　of　PBGA　solder　joints　based　on　vibration　failure　tests,　FEA　and　an　adjusted　Steinberg　fatigue　life　prediction　model.　The　results　show　the　model　is　effective　in　predicting　the　fatigue　life　of　solder　joints　under　random　vibration　condition.　The　methodology　can　be　applied　to　provide　models　and　tools　for　the　thermo-mechanical　reliability　design　of　PBGA　packaging.　©　2021,　Editorial　Office　of　Journal　of　Vibration　and　Shock.　All　right　reserved.

Keyword：

Thermal fatigue Tin alloys Lead alloys Forecasting Electronics packaging Soldered joints Predictive analytics Ball grid arrays

Author Community：

[ 1 ] [Qin, Fei]Institute of Electronics Packaging Technology and Reliability, College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
[ 2 ] [Bie, Xiaorui]Institute of Electronics Packaging Technology and Reliability, College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
[ 3 ] [Chen, Si]Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou; 510610, China
[ 4 ] [An, Tong]Institute of Electronics Packaging Technology and Reliability, College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China

Reprint Author's Address：

[chen, si]science and technology on reliability physics and application of electronic component laboratory, china electronic product reliability and environmental testing research institute, guangzhou; 510610, china

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Related Keywords：

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Source ：

Journal of Vibration and Shock

ISSN： 1000-3835

Year： 2021

Issue： 2

Volume： 40

Page： 164-170

Cited Count：

WoS CC Cited Count： 0

SCOPUS Cited Count： 6

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 7

Affiliated Colleges：

材料科学与工程学院本学院/部未明确归属的数据

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