Hot　compression　behavior　of　the　Cu-Co-Si　and　Cu-Co-Si-Ti　alloys　was　studied　using　the　Gleeble-1500　simulator　at　0.001-10　s(-1)　strain　rate　and　500-900　degrees　C　deformation　temperature.　Ti　addition　increased　the　flow　stress　of　the　Cu-Co-Si-Ti　alloy　compared　with　the　Cu-Co-Si　alloy　at　the　same　deformation　conditions.　With　the　deformation　temperature　increased　from　700　degrees　C　to　900　degrees　C,　the　Cu-Co-Si　alloy　texture　transformed　from　the　copper　texture　to　the　R　texture.　Due　to　the　addition　of　Ti,　the　copper　texture　and　R　texture　were　substituted　by　the　Goss　texture　and　the　copper　texture,　respectively.　The　constitutive　models　of　the　Cu-Co-Si　and　Cu-Co-Si-Ti　alloys　hot　deformation　behavior　were　obtained.　The　activation　energy　of　the　Cu-Co-Si　alloy　was　411.648　ki/mol,　and　the　activation　energy　of　the　Cu-Co-Si-Ti　alloy　was　500.794　ki/mol,　which　is　27%　higher.　The　precipitated　Co2Si　phase　was　found　in　both　Cu-Co-Si　and　Cu-Co-Si-Ti　alloys　deformed　at　700　degrees　C　and　0.001　s(-1).　In　addition,　the　CoSi　and　Cu4Ti　phases　were　found　in　the　Cu-Co-Si　and　Cu-Co-Si-Ti　alloys,　respectively.　The　strengthening　mechanisms,　including　dispersion　strengthening,　twinning　and　grain　refinement　strengthening,　control　the　Cu　-　Co-Si-Ti　alloy　hot　deformation,　and　lead　to　increased　flow　stress　and　activation　energy,　and　inhibit　dynamic　recrystallization　of　the　Cu-Co-Si-Ti　alloy.　(C)　2019　Elsevier　B.V.　All　rights　reserved.