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Author:

Li, Ran (Li, Ran.) | Xia, Guodong (Xia, Guodong.) (Scholars:夏国栋)

Indexed by:

EI Scopus SCIE

Abstract:

Capillary-driven evaporation of liquids play an important role in the thermal management of electronic devices. The recently developed nano-porous evaporator supported by microchannels proved to be promising in heat dissipation and energy saving. In this work, we proposed novel modifications to the nano-porous evaporator structure which could simultaneously enhance the dry-out heat flux and heat transfer coefficient. These include a non-uniformly distributed nanopore size and a membrane with shortened length. By conserving the farthest nanopore size and enlarging the closer nanopores, or simply removing part of the membrane, the pressure drop and thermal resistance of the evaporator were both minimized. Numerical approach was developed for simulating the heat transfer and fluid flow in the nano-porous evaporator. Kinetic boundary conditions were applied at the liquid-vapor interface to simulate evaporation. Results of temperature and pressure fields were obtained. It was found that the evaporative thermal resistance and the pressure drop in microchannel played dominant roles in determining the evaporator performance. The structure with partial membrane 10 mu m in length had the best heat dissipation performance, which improved the dry-out heat flux and heat transfer coefficient by 22.3% and 139.5%, respectively, compared to the benchmark evaporator structure.

Keyword:

Nano-porous membrane Structural modification Evaporation Electronics cooling Capillary wicks

Author Community:

  • [ 1 ] [Li, Ran]Beijing Univ Technol, MOE Key Lab Enhanced Heat Transfer & Energy Conser, Beijing Key Lab Heat Transfer & Energy Convers, Beijing 100124, Peoples R China
  • [ 2 ] [Xia, Guodong]Beijing Univ Technol, MOE Key Lab Enhanced Heat Transfer & Energy Conser, Beijing Key Lab Heat Transfer & Energy Convers, Beijing 100124, Peoples R China

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Source :

APPLIED THERMAL ENGINEERING

ISSN: 1359-4311

Year: 2022

Volume: 212

6 . 4

JCR@2022

6 . 4 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:49

JCR Journal Grade:1

CAS Journal Grade:1

Cited Count:

WoS CC Cited Count: 7

SCOPUS Cited Count: 7

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 9

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