To　reduce　the　adhesion　and　friction　between　polymer　and　mould　surfaces　during　polymeric　micro/nano　structures　replication,　we　have　used　tungsten　disulfide　(WS2)　nanosheets　to　fabricate　high-performance　nickel/WS2　nanocomposite　mould　using　electroforming.　However,　the　aggregation　of　WS2　nanosheets　in　the　electroforming　solution　is　a　critical　issue　that　influences　the　mechanical　and　tribological　properties　of　the　mould.　In　this　study,　we　first　propose　a　new　strategy　of　combining　anionic　surfactant　sodium　dodecyl　sulfate　(SDS)　and　cationic　surfactant　cetyltrimethylammonium　bromide　(CTAB)　to　achieve　uniform　dispersion　and　incorporation　of　WS2　nanosheets　in　the　electroformed　nickel　mould.　Our　results　indicate　that　appropriately　designing　the　structure　of　CTAB-SDS　complex　can　achieve　a　stable　WS2　dispersion,　contributing　to　the　uniform　co-deposition　of　WS2　nanosheets　into　nickel　mould.　The　combination　of　high　concentration　of　CTAB　and　SDS　(1.0　g/L　CTAB　and　1.0　g/　L　SDS)　significantly　improved　the　dispersibility　and　incorporation　of　WS2　into　the　nickel　matrix,　compared　to　individual　SDS　or　CTAB.　Consequently,　the　maximum　hardness　enhanced　by　350%　from　284　HV　for　pure　nickel　to　1280　HV　for　nickel/WS2　nanocomposite　mould,　along　with　the　coefficient　of　friction　(COF)　against　the　polymethyl　methacrylate　(PMMA)　pin　reducing　from　0.75　to　0.31.　It　is　also　found　that　CTAB　promotes　particle　encapsulation　while　SDS　improves　the　particle　dispersion　but　cannot　control　the　particle　incorporation.　The　surface　wettability　of　nickel/WS(2)mould　altered　to　hydrophobicity　from　hydrophilicity　of　nickel　mould,　where　the　adhesion-induced　wear　caused　by　polymer　pin　significantly　reduced.　Moreover,　the　surface　roughness　did　not　change　much　with　the　incorporation　of　WS2　into　the　mould,　which　is　acceptable　for　mould　applications.　Finally,　the　nickel/WS2　nanocomposite　mould　was　successfully　fabricated　via　electroforming　and　its　self-lubricating　properties　was　validated　by　micro　hot　embossing　PMMA　microfluidic　chips　with　good　surface　quality.