Since　the　three-dimensional　Network　on　Chip　(3D　NoC)　uses　through-silicon　via　technology　to　connect　the　chips,　each　silicon　layer　is　conducted　through　heterogeneous　thermal,　and　3D　NoC　system　suffers　from　thermal　problems.　To　alleviate　the　seriousness　of　the　thermal　problem,　the　distribution　of　data　packets　usually　relies　on　traffic　information　or　historical　temperature　information.　However,　thermal　problems　in　3D　NoC　cannot　be　solved　only　based　on　traffic　or　temperature　information.　Therefore,　we　propose　a　Score-Based　Traffic-and　Thermal-Aware　Adaptive　Routing　(STTAR)　that　applies　traffic　load　and　temperature　information　to　routing.　First,　the　STTAR　dynamically　adjusts　the　input　and　output　buffer　lengths　of　each　router　with　traffic　load　information　to　limit　routing　resources　in　overheated　areas　and　control　the　rate　of　temperature　rise.　Second,　STTAR　adopts　a　scoring　strategy　based　on　temperature　and　the　number　of　free　slots　in　the　buffer　to　avoid　data　packets　being　transmitted　to　high-temperature　areas　and　congested　areas　and　to　improve　the　rationality　of　selecting　routing　output　nodes.　In　our　experiments,　the　proposed　scoring　Score-Based　Traffic-and　Thermal-Aware　Adaptive　Routing　(STTAR)　scheme　can　increase　the　throughput　by　about　14.98%　to　47.90%　and　reduce　the　delay　by　about　10.80%　to　35.36%　compared　with　the　previous　works.