In　this　paper,　plasmonic　Ag　and　Cu　nanoparticles　were　co-deposited　on　TiO2　nanoring/nanotube　arrays　(TiO2　R/T)　by　using　two-step　pulse　electrodeposition　method　for　investigating　the　optical　and　photoelectrochemical　properties,　in　comparison　to　monometallic　Ag,　Cu　decoration.　By　optimizing　the　electrodeposition　cycle　times　and　electrolyte　concentration,　bimetallic　Ag-Cu/TiO2　R/T-0.5　with　moderate　densities　and　sizes　of　Ag　and　Cu　nanoparticles　was　fabricated　and　shows　great　photocatalytic　potential,　in　which,　Ag　mainly　facilitates　the　generation　of　hot　electrons　by　absorbing　visible　light　and　Cu　plays　an　important　role　in　accelerating　the　separation　and　transportation　of　hot　electrons.　The　hydrogen　production　rate　was　tested　as　425　mu　L　h(-1)　cm(-2),　which　is　about　1.34-fold　enhanced　H2　production　over　TiO2　R/T.　Furthermore,　molecular　dynamics　simulations　were　made　for　analyzing　the　interface　electrostatic　properties　between　plasmonic　nanoparticles　of　Ag　or　Cu　and　the　semiconductor　TiO2.　It　is　calculated　that　bimetallic　Ag-Cu/TiO2/H2O　system　has　larger　interfacial　Helmholtz　potential　than　monometallic　Ag/TiO2/H2O,　Cu/TiO2/H2O　and　pure　TiO2/H2O　systems,　accelerating　the　four-electron　reaction　occurring　at　the　semiconductor/electrolyte　interface.　This　research　put　forward　a　feasible　and　simple　pulse　electrodeposition　method　to　fabricate　bimetallic　photoanodes　for　enhanced　hydrogen　evolution　and　an　important　analysis　method　of　semiconductor/　metal/electrolyte　interface　characteristics.　(C)　2022　The　Society　of　Powder　Technology　Japan.　Published　by　Elsevier　B.V.　and　The　Society　of　Powder　Technology　Japan.