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Author:

Qin, Fei (Qin, Fei.) | He, Qi (He, Qi.) | Gong, Yanpeng (Gong, Yanpeng.) | An, Tong (An, Tong.) | Chen, Pei (Chen, Pei.) | Dai, Yanwei (Dai, Yanwei.)

Indexed by:

EI Scopus SCIE

Abstract:

This paper presents a finite element method and boundary element method (FEM-BEM) coupling scheme to study the steady-state 2D heat transfer problem for structures with multi-scale features. Based on the geometric information or material properties, the considered model is divided into FE sub-domain and BE sub-domain. The closed BE sub-domain in the mixed FEM-BEM model is defined as a finite super-element for which the effective stiffness matrix and effective fluxes are obtained by the self written BE code and hence can be assembled to the FE systems by the user subroutine (UEL) provided in ABAQUS. This method offers a number of key improvements compared with current analysis methods available for multi-scale structures. These improvements are: (i) the flexibility and convenience by using the powerful pre/post-processing in ABAQUS; (ii) the higher accuracy of the solution over the classical FEM; and (iii) the computational cost and time can be highly reduced by using the coupling method. Numerical results are compared with reference solutions and demonstrate the accuracy and effectiveness of the proposed approach. © 2022 Elsevier Ltd

Keyword:

Finite element method Sailing vessels Stiffness matrix Heat transfer Boundary element method ABAQUS

Author Community:

  • [ 1 ] [Qin, Fei]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [Qin, Fei]Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [He, Qi]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 4 ] [Gong, Yanpeng]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 5 ] [Gong, Yanpeng]Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 6 ] [An, Tong]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 7 ] [An, Tong]Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 8 ] [Chen, Pei]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 9 ] [Chen, Pei]Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 10 ] [Dai, Yanwei]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 11 ] [Dai, Yanwei]Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China

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Source :

Engineering Analysis with Boundary Elements

ISSN: 0955-7997

Year: 2022

Volume: 137

Page: 78-90

3 . 3

JCR@2022

3 . 3 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:49

JCR Journal Grade:1

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 8

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 6

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