In　the　present　study,　the　intermetallic　compound　(IMC)　joints　consisting　of　Cu3Sn　were　aged　at　high　temperatures　of　540,　560,　and　580　°C　to　form　a　sole　phase　of　Cu41Sn11　in　a　short　time　period.　The　variations　in　morphology,　growth　kinetics,　and　grain　orientation　for　the　Cu41Sn11　phase　originating　from　the　Cu3Sn　during　the　high　temperature　conditions　were　systematically　investigated.　The　original　Cu3Sn　phase　appeared　as　slender　grains,　while　the　final　phase,　which　contained　Cu41Sn11　grains,　was　displayed　as　coarse　columnar　grains.　The　growth　kinetics　for　the　Cu41Sn11　phase　during　the　540,　560,　and　580　°C　temperature　testing　periods　were　roughly　controlled　by　the　grain　boundary　diffusion　and　more　precisely　controlled　by　the　activation　energy,　which　was　72.86　kJ/mol.　The　growth　rate　constant　of　k0　was　2.5*10^7　μm3/min.　The　original　Cu3Sn　phase　exhibited　two　preferred　orientations　of　[100]　and　[203],　while　the　Cu41Sn11　phase　did　not　exhibit　the　apparent　grain　orientation.　Various　temperatures　had　specific　effects　on　the　kinetics　and　the　orientation:　The　newly　formed　Cu41Sn11　grains　were　used　to　maintain　the　coherent　or　semi-coherent　interface　((111)F//(100)P　and　[101]F//[010]P)　and　reduce　the　interfacial　energy,　which　resulted　in　the　step-growth　mechanism　during　the　early　stage　noted　at　540　°C　(lower　temperature);　by　contrast,　non-coherent　interface　between　Cu3Sn　and　Cu41Sn11　was　formed　during　the　higher　temperature　(580　°C),　which　also　resulted　in　the　formation　of　more　small-size　cores　with　large　amounts　of　grain　boundaries　without　apparent　orientation;　their　mechanism　of　growth　was　controlled　by　the　grain　boundary　diffusion.　©　2022　Elsevier　B.V.