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Author:

Zheng, Gangfeng (Zheng, Gangfeng.) | Li, Ze (Li, Ze.) | Liu, Songfeng (Liu, Songfeng.) | Dong, Hao (Dong, Hao.) | Wu, Bin (Wu, Bin.) | He, Cunfu (He, Cunfu.)

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EI Scopus SCIE

Abstract:

In this paper, a cylindrical aluminum sample with an eccentric circular hole was prepared, and ultrasonic measurements were carried out by experimental means. The measurement area was limited to a plane edge perpendicular to the axis of the cylindrical component. The measured waveform data were input into the formula of approximate correction method, and the section image was obtained by using a modified Born approximation (MBA) method. Then, the three-dimensional (3D) shape of the defects in the aluminum sample was reconstructed by superimposing the cross-sectional images. Results showed that the defect reconstruction effect of the two-dimensional section and the 3D defect reconstruction effect were significantly improved by the MBA method. © 2022 Gangfeng Zheng et al.

Keyword:

Born approximation Defects Aluminum Image reconstruction

Author Community:

  • [ 1 ] [Zheng, Gangfeng]School of Materials Science and Engineering, Anhui University of Science and Technology, Huainan; 232001, China
  • [ 2 ] [Li, Ze]School of Materials Science and Engineering, Anhui University of Science and Technology, Huainan; 232001, China
  • [ 3 ] [Liu, Songfeng]School of Materials Science and Engineering, Anhui University of Science and Technology, Huainan; 232001, China
  • [ 4 ] [Dong, Hao]School of Materials Science and Engineering, Anhui University of Science and Technology, Huainan; 232001, China
  • [ 5 ] [Wu, Bin]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100022, China
  • [ 6 ] [He, Cunfu]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100022, China

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Source :

Journal of Sensors

ISSN: 1687-725X

Year: 2022

Volume: 2022

1 . 9

JCR@2022

1 . 9 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:49

JCR Journal Grade:3

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 1

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 6

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