High-speed　rotation-induced　hypergravity　brings　extra　force　to　working　alloys,　which　may　change　their　diffusion　behavior　at　metal-couple　interfaces.　Cu-Sn　couples　are　conventionally　used　in　the　electronics　industry,　and　their　diffusion　behavior　is　crucial　for　electronic　safety.　The　diffusion　behavior　of　the　Cu-Sn　couple　was　studied　under　thermal　hypergravity　induced　by　high-speed　rotation,　and　its　diffusion　mechanism　was　revealed　by　advanced　microscopy.　The　hypergravity　in　our　Cu-Sn　couple　can　be　regarded　as　tension,　and　it　suppresses　the　diffusion　speed　at　210　?　by　a　dramatically　thick　decrease　in　the　Cu3Sn　intermetallic　phase.(c)　2022　Elsevier　B.V.　All　rights　reserved.