In　this　study,　the　finite　element　method　was　used　to　simulate　and　analyze　thermal　stresses　of　molybdenum　disulfide　(MoS2).　Two　models　with　or　without　micronized　holes　on　the　substrate　were　developed　to　simulate　the　distribution　of　thermal　stresses,　and　thermal　stresses　of　the　two　models　were　compared.　Relationships　between　thermal　stresses　and　temperature.　MoS2,　layer　thickness,　and　substrate　thickness　were　analyzed.　The　thermal　stress　of　the　substrate　supported　MoS2　was　larger　than　that　of　the　suspended　MoS2.　Moreover,　the　thermal　stress　of　the　MoS2　surrounding　the　suspended　MoS2,　was　higher　than　that　of　the　suspended　part.　Our　results　demonstrate　that　the　thermal　stresses　of　MoS2　increased　with　decrease　in　temperature.　decrease　in　MoS2　thickness.　and　increase　in　substrate　thickness.