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Author:

Zhang, Ying (Zhang, Ying.) | Mao, Ge-Qi (Mao, Ge-Qi.) | Zhao, Xiaolong (Zhao, Xiaolong.) | Li, Yu (Li, Yu.) | Zhang, Meiyun (Zhang, Meiyun.) | Wu, Zuheng (Wu, Zuheng.) | Wu, Wei (Wu, Wei.) | Sun, Huajun (Sun, Huajun.) | Guo, Yizhong (Guo, Yizhong.) | Wang, Lihua (Wang, Lihua.) | Zhang, Xumeng (Zhang, Xumeng.) | Liu, Qi (Liu, Qi.) | Lv, Hangbing (Lv, Hangbing.) | Xue, Kan-Hao (Xue, Kan-Hao.) | Xu, Guangwei (Xu, Guangwei.) | Miao, Xiangshui (Miao, Xiangshui.) | Long, Shibing (Long, Shibing.) | Liu, Ming (Liu, Ming.)

Indexed by:

Scopus SCIE

Abstract:

Understanding the mechanism of the formation and rupture of conductive filaments in HfO2-based memristors is essential to solve the problem of scalability of the devices. Here, Zhang et al. visualize this process by tracking atomic-scale evolution of conductive filaments during resistive switching cycles. The resistive switching effect in memristors typically stems from the formation and rupture of localized conductive filament paths, and HfO2 has been accepted as one of the most promising resistive switching materials. However, the dynamic changes in the resistive switching process, including the composition and structure of conductive filaments, and especially the evolution of conductive filament surroundings, remain controversial in HfO2-based memristors. Here, the conductive filament system in the amorphous HfO2-based memristors with various top electrodes is revealed to be with a quasi-core-shell structure consisting of metallic hexagonal-Hf6O and its crystalline surroundings (monoclinic or tetragonal HfOx). The phase of the HfOx shell varies with the oxygen reservation capability of the top electrode. According to extensive high-resolution transmission electron microscopy observations and ab initio calculations, the phase transition of the conductive filament shell between monoclinic and tetragonal HfO2 is proposed to depend on the comprehensive effects of Joule heat from the conductive filament current and the concentration of oxygen vacancies. The quasi-core-shell conductive filament system with an intrinsic barrier, which prohibits conductive filament oxidation, ensures the extreme scalability of resistive switching memristors. This study renovates the understanding of the conductive filament evolution in HfO2-based memristors and provides potential inspirations to improve oxide memristors for nonvolatile storage-class memory applications.

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Author Community:

  • [ 1 ] [Zhang, Ying]Chinese Acad Sci, Key Lab Microelect Devices & Integrat Technol, Inst Microelect, Beijing 100029, Peoples R China
  • [ 2 ] [Li, Yu]Chinese Acad Sci, Key Lab Microelect Devices & Integrat Technol, Inst Microelect, Beijing 100029, Peoples R China
  • [ 3 ] [Zhang, Meiyun]Chinese Acad Sci, Key Lab Microelect Devices & Integrat Technol, Inst Microelect, Beijing 100029, Peoples R China
  • [ 4 ] [Wu, Zuheng]Chinese Acad Sci, Key Lab Microelect Devices & Integrat Technol, Inst Microelect, Beijing 100029, Peoples R China
  • [ 5 ] [Zhang, Xumeng]Chinese Acad Sci, Key Lab Microelect Devices & Integrat Technol, Inst Microelect, Beijing 100029, Peoples R China
  • [ 6 ] [Liu, Qi]Chinese Acad Sci, Key Lab Microelect Devices & Integrat Technol, Inst Microelect, Beijing 100029, Peoples R China
  • [ 7 ] [Lv, Hangbing]Chinese Acad Sci, Key Lab Microelect Devices & Integrat Technol, Inst Microelect, Beijing 100029, Peoples R China
  • [ 8 ] [Liu, Ming]Chinese Acad Sci, Key Lab Microelect Devices & Integrat Technol, Inst Microelect, Beijing 100029, Peoples R China
  • [ 9 ] [Zhang, Ying]Univ Sci & Technol China, Sch Microelect, Hefei 230026, Peoples R China
  • [ 10 ] [Zhao, Xiaolong]Univ Sci & Technol China, Sch Microelect, Hefei 230026, Peoples R China
  • [ 11 ] [Xu, Guangwei]Univ Sci & Technol China, Sch Microelect, Hefei 230026, Peoples R China
  • [ 12 ] [Long, Shibing]Univ Sci & Technol China, Sch Microelect, Hefei 230026, Peoples R China
  • [ 13 ] [Zhang, Ying]Univ Chinese Acad Sci, Beijing 100049, Peoples R China
  • [ 14 ] [Zhang, Meiyun]Univ Chinese Acad Sci, Beijing 100049, Peoples R China
  • [ 15 ] [Wu, Zuheng]Univ Chinese Acad Sci, Beijing 100049, Peoples R China
  • [ 16 ] [Zhang, Xumeng]Univ Chinese Acad Sci, Beijing 100049, Peoples R China
  • [ 17 ] [Liu, Qi]Univ Chinese Acad Sci, Beijing 100049, Peoples R China
  • [ 18 ] [Lv, Hangbing]Univ Chinese Acad Sci, Beijing 100049, Peoples R China
  • [ 19 ] [Liu, Ming]Univ Chinese Acad Sci, Beijing 100049, Peoples R China
  • [ 20 ] [Mao, Ge-Qi]Huazhong Univ Sci & Technol, Sch Integrated Circuits, Sch Opt & Elect Informat, Wuhan 430074, Peoples R China
  • [ 21 ] [Wu, Wei]Huazhong Univ Sci & Technol, Sch Integrated Circuits, Sch Opt & Elect Informat, Wuhan 430074, Peoples R China
  • [ 22 ] [Sun, Huajun]Huazhong Univ Sci & Technol, Sch Integrated Circuits, Sch Opt & Elect Informat, Wuhan 430074, Peoples R China
  • [ 23 ] [Xue, Kan-Hao]Huazhong Univ Sci & Technol, Sch Integrated Circuits, Sch Opt & Elect Informat, Wuhan 430074, Peoples R China
  • [ 24 ] [Miao, Xiangshui]Huazhong Univ Sci & Technol, Sch Integrated Circuits, Sch Opt & Elect Informat, Wuhan 430074, Peoples R China
  • [ 25 ] [Guo, Yizhong]Beijing Univ Technol, Inst Microstruct & Property Adv Mat, Beijing Key Lab Microstruct & Property Adv Mat, Beijing 100124, Peoples R China
  • [ 26 ] [Wang, Lihua]Beijing Univ Technol, Inst Microstruct & Property Adv Mat, Beijing Key Lab Microstruct & Property Adv Mat, Beijing 100124, Peoples R China
  • [ 27 ] [Zhang, Xumeng]Fudan Univ, Frontier Inst Chip & Syst, Shanghai 200433, Peoples R China
  • [ 28 ] [Liu, Qi]Fudan Univ, Frontier Inst Chip & Syst, Shanghai 200433, Peoples R China
  • [ 29 ] [Liu, Ming]Fudan Univ, Frontier Inst Chip & Syst, Shanghai 200433, Peoples R China

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Source :

NATURE COMMUNICATIONS

Year: 2021

Issue: 1

Volume: 12

1 6 . 6 0 0

JCR@2022

ESI Discipline: Multidisciplinary;

ESI HC Threshold:169

JCR Journal Grade:1

Cited Count:

WoS CC Cited Count: 146

SCOPUS Cited Count: 142

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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