This　paper　reports　the　wafer　level　surface　acoustic　wave　(SAW)　filter　package　design,　fabrication　technology,　and　reliability　aspects.　The　key　process　including　cavity　wall　(CV)　dam　fabricating,　non-photosensitive　dry　film　lamination,　redistribution　layer　(RDL),　and　ball-grid　array　formation　are　developed.　Additionally,　a　computer　research　using　the　finite　element　model　(FEM)　has　been　done　to　examine　the　evolution　of　wafer　warpage.　The　results　match　the　experiment　well.　After　the　fabrication　process　optimization,　the　reliability　of　the　packages　is　characterized　by　pre-conditional　level　3　(Pre　Con-L3)　and　unbiased-highly　accelerated　stress　(uHAST),　and　the　results　show　a　good　package　level　reliability.　This　work　offers　insight　work　for　the　SAW　filter　package　design.　　©　2022　IEEE.