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Author:

Liu, Wei (Liu, Wei.) | Dai, Yanwei (Dai, Yanwei.) (Scholars:代岩伟) | Liu, Yinghua (Liu, Yinghua.) | Kong, Weichen (Kong, Weichen.)

Indexed by:

EI Scopus SCIE

Abstract:

Nonproportional loading and residual stresses effects on creep crack tip fields are important topics in fracture mechanics at elevated temperature. In this paper, nonproportional loading and residual stresses effects on creep crack tip fields are systematically investigated based on the novel interpretation of C(t)-integral considering residual stress. With the numerical implementation of the corrected C(t)-integral considering residual stress, the eigenstrain and mechanical induced residual stress effects on the creep crack tip fields are studied. We find that C(t)-integral level is affected remarkably in the presence of residual stress regardless of eigenstrain or mechanical induced residual stresses for creep crack tip under small scale creep. However, level of C*-integral is not significantly influenced under the effects of residual stresses in presence of large-scale creep although the transition creep time is remarkably changed. Otherwise, C(t)-integral is highly affected by loading path under small scale creep. However, C*-integral is independent of the loading path if the creep time is long enough. Nonproportional loading effect on C*-integral is very limited for creep crack tip field according to our study. The investigation given in this paper could deepen the understanding the effects of residual stress and nonproportional loading on the creep crack tip field.

Keyword:

Crack tip fields C(t)-integral Residual stress Creep crack Nonproportional loading

Author Community:

  • [ 1 ] [Liu, Wei]Tsinghua Univ, Dept Engn Mech, AML, Beijing 100084, Peoples R China
  • [ 2 ] [Liu, Yinghua]Tsinghua Univ, Dept Engn Mech, AML, Beijing 100084, Peoples R China
  • [ 3 ] [Kong, Weichen]Tsinghua Univ, Dept Engn Mech, AML, Beijing 100084, Peoples R China
  • [ 4 ] [Dai, Yanwei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Fac Mat & Mfg, Beijing 100124, Peoples R China

Reprint Author's Address:

  • [Liu, Yinghua]Tsinghua Univ, Dept Engn Mech, AML, Beijing 100084, Peoples R China;;[Dai, Yanwei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Fac Mat & Mfg, Beijing 100124, Peoples R China;;

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Source :

ENGINEERING FRACTURE MECHANICS

ISSN: 0013-7944

Year: 2023

Volume: 281

5 . 4 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:19

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 4

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