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Author:

Zhang, C. (Zhang, C..) | Li, C. (Li, C..) | Wang, Z. (Wang, Z..) | Li, W. (Li, W..) | Li, Z. (Li, Z..) | Yang, S. (Yang, S..)

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Scopus

Abstract:

Aiming at the problems of large thermal resistance and uneven light output of high-power vertical cavity surface emitting laser (VCSEL) array,this paper studies the action mechanism of ohmic contact resistance of p-GaAs layer and the method of reducing ohmic contact series resistance, so as to improve the uniformity of light output power of VCSEL array. Based on three commonly used ohmic contact metals Ti/Au, Ni/Au and Ti/Au/Ti/Au,the effects of metal thickness and metal combination on p-type ohmic contact resistance are studied. Combined with plasma surface treatment process, the iner-face state of metal/p-GaAs is improved, the effect of metal/p-GaAs interface state on ohmic contact resistance is studied. The experimental comparative analysis shows that the specific contact resistivity of ohmic contact of metal Ti/Au structure electrode is the lowest,which is 3. 25X10 Cl • cm". Based on the metal/ semiconductor contact potential barrier model, the interface potential barrier can be reduced by 12. 6% (0.269 2 eV to 0.235 3 eV) by surface plasma treatment, and the plasma bombardment power can regulate the potential barrier and density of states on the metal/semiconductor interface. © 2023 Board of Optronics Lasers. All rights reserved.

Keyword:

ohmic contact vertical cavity surface emitting laser (VCSEL) specific contact resistivity plasma surface treatment barrier

Author Community:

  • [ 1 ] [Zhang C.]Department of Materials and Manufacturing, Institute of Advanced Technology on Semiconductor Optics and Electronics, Beijing University of Technology, Beijing, 100121, China
  • [ 2 ] [Li C.]Department of Information, Key Laboratory of Optoelectronic Technology, Beijing University of Technology, Ministry of Education, Beijing, 100121, China
  • [ 3 ] [Wang Z.]Department of Materials and Manufacturing, Institute of Advanced Technology on Semiconductor Optics and Electronics, Beijing University of Technology, Beijing, 100121, China
  • [ 4 ] [Li W.]Department of Information, Key Laboratory of Optoelectronic Technology, Beijing University of Technology, Ministry of Education, Beijing, 100121, China
  • [ 5 ] [Li Z.]Department of Information, Key Laboratory of Optoelectronic Technology, Beijing University of Technology, Ministry of Education, Beijing, 100121, China
  • [ 6 ] [Yang S.]Department of Information, Key Laboratory of Optoelectronic Technology, Beijing University of Technology, Ministry of Education, Beijing, 100121, China

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Source :

Journal of Optoelectronics Laser

ISSN: 1005-0086

Year: 2023

Issue: 4

Volume: 34

Page: 358-363

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 1

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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