The　packaging　structure,　internal　defects,　and　external　loads　have　a　significant　impact　on　the　reliability　and　ultimate　failure　of　chip　performance.　Therefore,　establishing　a　refined　model　that　considers　multiple　factors　is　of　great　significance　for　improving　the　reliability　and　optimizing　design　of　packaging　structures.　For　this　purpose,　this　study　firstly　adopts　CT　scanning　technology　to　reconstruct　the　ball　grid　array　(BGA)　package　structure　in　three　dimensions,　optimize　the　finite　element　meshing,　and　analyze　the　drop　behavior　by　using　the　finite　element　method　based　on　nonlinear　damage　instantiation.　In　addition,　to　further　investigate　the　effect　of　fine　defects　on　the　failure　of　the　package　structure,　a　simulation　of　the　damage　evolution　behavior　of　a　real　defective　solder　ball　structure　under　impact　loading　is　implemented　with　the　help　of　submodeling　techniques.　The　research　results　provide　a　technical　reference　for　the　reliability　analysis　and　multi-occasion　structure　design　of　aerospace　BGA　package　structures.　©　2023