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Author:

Wang, C. (Wang, C..) | Jiang, Z. (Jiang, Z..) | Ma, X. (Ma, X..) | Zhang, Y. (Zhang, Y..) | He, P. (He, P..) | Han, F. (Han, F..)

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EI Scopus SCIE

Abstract:

2319 aluminum alloy was prepared using wire arc additive manufacturing (WAAM) technique. The solid solution time of achieving improving corrosion resistance in WAAM 2319 aluminum alloy was investigated. The results indicated that the as deposited 2319 aluminum alloy was composed of dendritic grains. Numerous inter-granular intermetallic were continuously distributed along the grain boundary. As the solid solution time increased, the inter-granular intermetallic gradually dissolved into α-Al matrix resulting in discontinuously distribution and more homogeneous element distribution. Electrochemical experiment results indicated that the corrosion potential of WAAM 2319 aluminum alloy gradually increased with the increase of solid solution time. This indicated that increasing solid solution time could effectively increased the corrosion resistance of WAAM 2319 aluminum alloy. Improved corrosion resistance can be attributed to refined and discontinuous inter-granular intermetallic. © 2023 The Authors

Keyword:

Additive manufacture Aluminum alloy Corrosion Solid solution treatment

Author Community:

  • [ 1 ] [Wang C.]School of Mechanical Engineering, Beijing Institute of Petrochemical Technology, Beijing, 102617, China
  • [ 2 ] [Jiang Z.]School of Mechanical Engineering, Beijing Institute of Petrochemical Technology, Beijing, 102617, China
  • [ 3 ] [Ma X.]Capital Aerospace Machinery Corporation Limited, Beijing, 100076, China
  • [ 4 ] [Zhang Y.]Faculty of Materials and Manufacturing, Beijing University of Technology, 100124, China
  • [ 5 ] [He P.]State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China
  • [ 6 ] [Han F.]School of Mechanical Engineering, Beijing Institute of Petrochemical Technology, Beijing, 102617, China

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Source :

Journal of Materials Research and Technology

ISSN: 2238-7854

Year: 2023

Volume: 26

Page: 2749-2758

6 . 4 0 0

JCR@2022

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 25

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 10

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