Influence of crosslink density on the interfacial bonding performance for epoxy resin towards load-induced calcium silicate hydrate gel - Details

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Abstract：

In　epoxy-amine　based　self-healing　cement-based　materials,　the　uncontrollable　stoichiometric　ratio　of　both　components　in　the　cracks　leads　to　the　cured　epoxy　resin　with　various　crosslink　densities.　Investigation　on　the　interaction　mechanism　between　cured　epoxy　resin　and　C-S-H　gel　promotes　to　optimize　the　final　self-healing　performances.　In　this　work,　the　interaction　between　load-induced　broken　panels　of　C-S-H　gel　and　cured　epoxy　resins　with　different　crosslink　densities　(e.g.,　0.23,　0.77,　and　0.97)　was　studied　through　molecular　dynamic　methods.　It　was　found　that　crosslink　density　plays　an　essential　role　in　the　geometrical　size　and　atom　distributions.　Phase　separation　occurs　at　the　low　crosslink　density　due　to　the　aggregation　of　amine　molecules.　The　generation　of　fresh　crosslink　points　limits　the　free　motion　of　epoxy　molecules　with　higher　crosslink　density.　Meanwhile,　the　cured　epoxy　resin　with　higher　crosslink　density　causes　a　high　porosity　in　the　interfacial　region　between　the　epoxy　resin　and　C-S-H　gel　substrates,　degrading　the　mechanical　performance　of　materials.　©　2023

Keyword：

Molecular dynamics Deformation and fracture process Epoxy resin Load-induced C–S–H nanochannels Crosslink density

Author Community：

[ 1 ] [Sun D.]College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, China
[ 2 ] [Wang J.]College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, China
[ 3 ] [Wang H.]State Key Laboratory of Solid Waste Reuse for Building Materials, Beijing Building Materials Academy of Sciences Research, Beijing, 100041, China
[ 4 ] [Yan Z.]College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, China
[ 5 ] [Ma W.]College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, China
[ 6 ] [Ma X.]College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, China
[ 7 ] [Wang Y.]College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, China
[ 8 ] [Ma Z.]Key Technologies R&D Program of CNBM, China
[ 9 ] [Jin X.]College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, China
[ 10 ] [Sun S.]College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, China
[ 11 ] [Cui S.]College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, China
[ 12 ] [Wang Z.]Institute of Artificial Intelligence and Data Science, Northeastern University, Shenyang, 110819, China
[ 13 ] [Wang Z.]School of Mechatronical Engineering, Beijing Institute of Technology, Beijing, 100081, China

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Related Keywords：

Thermal conductivity of epoxy resin using molecular dynamics simulation
2018，19th International Conference on Electronic Packaging Technology, ICEPT 2018
Uniaxial tensile deformation and fracture process of structures forming by unsaturated intercalation of amine molecule into C-S-H gel
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Source ：

Journal of Non-Crystalline Solids

ISSN： 0022-3093

Year： 2023

Volume： 619

3 . 5 0 0

JCR@2022

ESI Discipline： PHYSICS;

ESI HC Threshold：17

Cited Count：

WoS CC Cited Count： 0

SCOPUS Cited Count： 3

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 6

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