Effect of electric pulse incubation melt on solidified microstructures and mechanical properties of Sn58Bi alloy - Details

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Abstract：

Sn58Bi　alloy　is　a　typical　low-melting　point　solder.　However,　the　brittle　Bi　phase　would　lead　to　relatively　low　ductility　and　toughness,　limiting　its　application　in　advanced　2.5D/3D　electronic　packaging.　We　presented　a　strategy　to　enhance　the　ductility　of　Sn58Bi　alloy　by　electric　pulse　incubating　(EPI)　the　liquid　melt.　Unique　microstructures　including　pre-eutectic　Sn,　Bi-rich　phase　and　fine　Sn-Bi　eutectic　structure　were　obtained　due　to　different　size　atomic　clusters　in　melt　incubated　by　electric　pulse.　It　was　found　that　the　ductility　of　as-treated　samples　was　improved　significantly　as　the　applied　pulse　voltage　was　increased.　The　enhancement　should　be　attributed　to　cooperation　deformation　of　a　great　number　of　pre-eutectic　Sn　and　Bi-rich　phases.　This　research　could　help　to　provide　a　new　path　for　ductility　and　reliability　improvement　of　Sn-Bi　solder　joints　in　advanced　electronic　interconnection.　©　2023,　The　Author(s),　under　exclusive　licence　to　Springer　Science+Business　Media,　LLC,　part　of　Springer　Nature.

Keyword：

Binary alloys Electronics packaging Ductility Bismuth alloys Lead-free solders Eutectics Tin alloys Microstructure

Author Community：

[ 1 ] [Zhao, Jin]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
[ 2 ] [Zhao, Jin]Key Laboratory of Advanced Functional Materials, Education Ministry of China, Beijing University of Technology, Beijing; 100124, China
[ 3 ] [Ji, Xiaoliang]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
[ 4 ] [Ji, Xiaoliang]Key Laboratory of Advanced Functional Materials, Education Ministry of China, Beijing University of Technology, Beijing; 100124, China
[ 5 ] [Jia, Qiang]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
[ 6 ] [Jia, Qiang]Key Laboratory of Advanced Functional Materials, Education Ministry of China, Beijing University of Technology, Beijing; 100124, China
[ 7 ] [Wang, Yuxiang]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
[ 8 ] [Wang, Yuxiang]Key Laboratory of Advanced Functional Materials, Education Ministry of China, Beijing University of Technology, Beijing; 100124, China
[ 9 ] [Ma, Limin]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
[ 10 ] [Ma, Limin]Key Laboratory of Advanced Functional Materials, Education Ministry of China, Beijing University of Technology, Beijing; 100124, China
[ 11 ] [Wang, Yishu]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
[ 12 ] [Wang, Yishu]Key Laboratory of Advanced Functional Materials, Education Ministry of China, Beijing University of Technology, Beijing; 100124, China
[ 13 ] [Guo, Fu]Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
[ 14 ] [Guo, Fu]Key Laboratory of Advanced Functional Materials, Education Ministry of China, Beijing University of Technology, Beijing; 100124, China
[ 15 ] [Guo, Fu]School of Mechanical Electrical Engineering, Beijing Information Science and Technology University, Beijing; 100192, China

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Related Keywords：

Study of microstructure evolution and temperature distribution in eutectic SnBi solder joints under high current density
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Interfacial reaction between the thermopile materials and eutectic Sn-based solders
2011，2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
Phase segregation under reversed current stressing in eutectic Sn-based solder joints
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Effects of temperature and humidity on the formation of solder bead and microstructure in Sn-58Bi Solder joint
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Source ：

Journal of Materials Science: Materials in Electronics

ISSN： 0957-4522

Year： 2023

Issue： 30

Volume： 34

2 . 8 0 0

JCR@2022

ESI Discipline： MATERIALS SCIENCE;

ESI HC Threshold：26

Cited Count：

WoS CC Cited Count： 0

SCOPUS Cited Count： 2

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 5

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