The　failure　mechanism　of　sintered　Ag/Cu　interface　was　investigated　based　on　ENF　test,　so　as　to　study　the　change　law　of　mode　II　fracture　toughness　of　sintered　Ag/Cu　interface　at　different　low　strain　rates.　The　sandwich　structure　ENF　specimens　were　prepared　with　100　um-thick　nano-silver　paste　and　two　pieces　of　bare　copper.　The　sandwich　structure　was　sintered　at　a　sintering　temperature　of　280°C,　held　for　60　minutes,　and　at　a　heating　rate　of　10°C　per　minute　with　a　pressure　of　10　KPa.　The　ENF　specimens　were　tested　on　the　Instron　5948　micro　tester　with　a　three　point　bending　load　applied　four　different　strain　rates　at　room　temperature.　The　Hitachi　S4000　SEM　and　optical　microscopy　(OM)　were　used　to　analyze　the　fracture　morphology　and　microstructure　of　sintered　silver　layer　after　ENF　test.　Cracks　all　crack　from　the　sintered　Ag/Cu　interface　at　different　strain　rates.　The　compliance　based　beam　method　(CBBM)　was　used　by　researchers　for　fracture　analysis　of　ENF　specimens.　Under　the　certain　range　of　quasi-static　loading　conditions,　as　the　strain　rate　increases,　the　fracture　toughness　of　sintered　Ag/Cu　interface　decreases.　©　2021　IEEE.