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Author:

He, Cunfu (He, Cunfu.) (Scholars:何存富) | Liu, Yuepeng (Liu, Yuepeng.) | Liu, Zenghua (Liu, Zenghua.) (Scholars:刘增华) | Wu, Bin (Wu, Bin.)

Indexed by:

EI Scopus PKU CSCD

Abstract:

Monocrystalline silicon is one of the main materials that is used to make silicon solar cells. However, all kinds of defects existing in monocrystalline silicon have a great influence on the photoelectric conversion efficiency. In order to solve this problem, air-coupled Lamb waves testing method is proposed to achieve rapid quality evaluation of monocrystalline silicon products. The dispersion curves of Lamb waves in anisotropic monocrystalline silicon are calculated theoretically. The velocity distribution of Lamb waves at different directions is obtained. A0 mode of Lamb waves is excited in the monocrystalline silicon of (001) crystal plane by the air-coupled transducers. The relationship between the incident angle of Lamb waves and the amplitude of signal at 200 kHz is investigated, by which 13° is chosen as the optimal incident angle. The phase velocity is calculated by phase spectrum method. Experiment results show a great agreement with those theoretical values. The group velocity is measured by amplitude of wave packet method and the correlation function method. The deviation by the latter method is smaller to acquire the group velocity. Scanning method is used to detect the defect in the monocrystalline silicon. The location and size of the defect is reconstructed by calculating the correlation coefficient of the received signals and reference signals. ©, 2015, Journal of Mechanical Engineering. All right reserved.

Keyword:

Velocity distribution Photoelectricity Light velocity Testing Monocrystalline silicon Silicon solar cells Ultrasonic waves Defects Surface waves

Author Community:

  • [ 1 ] [He, Cunfu]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [Liu, Yuepeng]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [Liu, Zenghua]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 4 ] [Wu, Bin]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China

Reprint Author's Address:

  • 何存富

    [he, cunfu]college of mechanical engineering and applied electronics technology, beijing university of technology, beijing; 100124, china

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Source :

Journal of Mechanical Engineering

ISSN: 0577-6686

Year: 2015

Issue: 12

Volume: 51

Page: 1-7

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 5

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 10

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