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Author:

Dai, Yanwei (Dai, Yanwei.) (Scholars:代岩伟) | Zan, Zhi (Zan, Zhi.) | Zhao, Libo (Zhao, Libo.) | Qin, Fei (Qin, Fei.)

Indexed by:

EI Scopus SCIE

Abstract:

In this paper, the elastoplastic and creep constitutive behaviors of sintered silver with varying amounts of nickel-modified multiwall carbon nanotubes are studied through a systematic investigation of the nanoindentation test. Elastoplastic stress-strain curves for the sintered silver with different additive content are obtained based on reverse analysis. The addition of nickel-modified multiwall carbon nanotubes reduced the yielding stress from 110.68 MPa to 61.61 MPa and generally increased the strain-hardening exponent from 0.26 to 0.41. The initial and steady-state creep stress exponent remained almost unchanged. However, the creep coefficient increased remarkably. Otherwise, the yielding stress was confirmed to agree well with the Hall-Petch relation, and the hardening exponent was found to follow Morrison's law. The creep exponents and creep coefficients were also obtained and shown to be highly related to the particle size and positively correlated with porosity. The creep regime at room temperature was confirmed to obey Sherby's model. This investigation shows the effect of additive content on sintered silver. The study given in this paper could deepen the understanding of the strengthening effect of nickel-modified multiwall carbon nanotubes on the mechanical performance of sintered silver at room temperature.

Keyword:

nanoindentation Sintered Ag elastoplasticity creep nickel-modified multiwall carbon nanotubes

Author Community:

  • [ 1 ] [Dai, Yanwei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 2 ] [Zan, Zhi]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 3 ] [Zhao, Libo]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 4 ] [Qin, Fei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 5 ] [Dai, Yanwei]Beijing Univ Technol, Fac Mat & Mfg, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China
  • [ 6 ] [Qin, Fei]Beijing Univ Technol, Fac Mat & Mfg, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China

Reprint Author's Address:

  • [Dai, Yanwei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Fac Mat & Mfg, Beijing 100124, Peoples R China;;[Qin, Fei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Fac Mat & Mfg, Beijing 100124, Peoples R China;;[Dai, Yanwei]Beijing Univ Technol, Fac Mat & Mfg, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China;;[Qin, Fei]Beijing Univ Technol, Fac Mat & Mfg, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China;;

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Source :

JOURNAL OF ELECTRONIC MATERIALS

ISSN: 0361-5235

Year: 2023

Issue: 3

Volume: 53

Page: 1344-1359

2 . 1 0 0

JCR@2022

Cited Count:

WoS CC Cited Count: 6

SCOPUS Cited Count: 5

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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