This　study　proposes　a　novel　heat　sink　for　insulated-gate　bipolar　transistor　modules　utilizing　flat　miniature-heat-pipe　arrays.　The　influence　of　heat　load,　cooled-air　temperature,　and　distribution　mode　on　the　start-up　and　heat　dissipation　performance　of　the　proposed　heat　sink　with　and　without　aluminum　plate　was　investigated　experimentally　and　numerically.　As　a　result,　the　start-up　time　of　the　heat　sink　with　aluminum　plate　was　approximately　2-3　min,　and　maximum　temperature　for　heat　sink　was　76.8　degrees　C　under　cooled-air　parallel　flow　conditions　when　heat　flux　density　was　6.67　W　cm-2　and　cooled-air　temperature　was　40　degrees　C,　which　was　4.6　degrees　C　lower　than　that　obtained　without　aluminum　plate.　In　addition,　the　study　found　that　cooled-air　parallel　distribution　mode　was　better　for　heat　dissipation　than　opposite　distribution　mode,　and　that　maximum　temperature　decreased　more　obviously　as　the　heat　load　increased.　The　predicted　models　between　two　responses　and　four　independent　design　factors　were　obtained　by　response　surface　method,　and　the　interactive　impacts　of　different　factors　on　responses　were　studied.　Finally,　multi-objective　joint　optimization　was　developed　to　determine　the　optimal　dimensions　of　the　aluminum　plate　width,　longitudinal　fin　height,　spacing,　and　thickness,　which　were　82.02,　48.79,　1.5,　and　0.58　mm,　respectively,　to　minimize　maximum　temperature　and　materials　cost.