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Author:

Meng, X. (Meng, X..) | Zhang, M. (Zhang, M..) | Feng, S. (Feng, S..) | Tang, Y. (Tang, Y..) | Zhang, Y. (Zhang, Y..)

Indexed by:

EI Scopus SCIE

Abstract:

In this paper, a new online temperature measurement method for SiC power metal-oxide-semiconductor field-effect transistors (MOSFETs) is proposed that uses the linear relationship between the drain-source current(Ids) and the temperature of power electronic devices. The temperature-sensitive characteristics of the transfer characteristic curve of these MOSFETs are studied. The results show that under different applied gate voltages, the effects of temperature on the change in the Ids are different; under the same gate voltage, the drain-source current of each device maintains a good linear relationship with the temperature, which can be used to perform accurate junction temperature measurements of power MOSFETs. Based on this characteristic, by superimposing a pulse on the gate, characterizing the instantaneous current produced by this superimposed pulse, and combining this characteristic with the relationship between the Ids change and temperature, detection of the device's operating temperature under actual working conditions is realized. Furthermore, a related circuit is designed to reduce the influence of changes in the electrical bias on the system stability during temperature measurements. In addition, the measurement results are verified via infrared thermal imaging, and the results show that the proposed method has good practicability. IEEE

Keyword:

Logic gates Semiconductor device measurement junction temperature Temperature measurement MOSFET Temperature sensors three-phase bridge Voltage measurement SiC MOSFET drain-source current Current measurement

Author Community:

  • [ 1 ] [Meng X.]Institute of Semiconductor Device Reliability Physics, Beijing University of Technology, Beijing, China
  • [ 2 ] [Zhang M.]Institute of Semiconductor Device Reliability Physics, Beijing University of Technology, Beijing, China
  • [ 3 ] [Feng S.]Institute of Semiconductor Device Reliability Physics, Beijing University of Technology, Beijing, China
  • [ 4 ] [Tang Y.]Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China
  • [ 5 ] [Zhang Y.]Institute of Semiconductor Device Reliability Physics, Beijing University of Technology, Beijing, China

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Source :

IEEE Transactions on Power Electronics

ISSN: 0885-8993

Year: 2024

Issue: 4

Volume: 39

Page: 1-10

6 . 7 0 0

JCR@2022

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 5

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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