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Author:

Dai, Yanwei (Dai, Yanwei.) (Scholars:代岩伟) | Zhao, Libo (Zhao, Libo.) | Qin, Fei (Qin, Fei.) | Chen, Si (Chen, Si.)

Indexed by:

EI Scopus SCIE

Abstract:

PurposeThis study aims to characterize the mechanical properties of sintered nano-silver under various sintering processes by nano-indentation tests.Design/methodology/approachThrough microstructure observations and characterization, the influences of sintering process on the microstructure evolutions of sintered nano-silver were presented. And, the indentation load, indentation displacement curves of sintered silver under various sintering processes were measured by using nano-indentation test. Based on the nano-indentation test, a reverse analysis of the finite element calculation was used to determine the yielding stress and hardening exponent.FindingsThe porosity decreases with the increase of the sintering temperature, while the average particle size of sintered nano-silver increases with the increase of sintering temperature and sintering time. In addition, the porosity reduced from 34.88%, 30.52%, to 25.04% if the ramp rate was decreased from 25 degrees C/min, 15 degrees C/min, to 5 degrees C/min, respectively. The particle size appears more frequently within 1 mu m and 2 mu m under the lower ramp rate. With reverse analysis, the strain hardening exponent gradually heightened with the increase of temperature, while the yielding stress value decreased significantly with the increase of temperature. When the sintering time increased, the strain hardening exponent increased slightly.Practical implicationsThe mechanical properties of sintered nano-silver under different sintering processes are clearly understood.Originality/valueThis paper could provide a novel perspective on understanding the sintering process effects on the mechanical properties of sintered nano-silver.

Keyword:

Microstructure evolution Nano-indentation Elastoplastic behaviors Sintered nano-silver Sintering process

Author Community:

  • [ 1 ] [Dai, Yanwei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Dept Mech, Beijing, Peoples R China
  • [ 2 ] [Zhao, Libo]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Dept Mech, Beijing, Peoples R China
  • [ 3 ] [Qin, Fei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Dept Mech, Beijing, Peoples R China
  • [ 4 ] [Chen, Si]China Elect Product Reliabil & Environm Testing R, Sci & Technol Reliabil Phys & Applicat Elect Comp, Guangzhou, Peoples R China

Reprint Author's Address:

  • 代岩伟

    [Dai, Yanwei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Dept Mech, Beijing, Peoples R China;;[Qin, Fei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Dept Mech, Beijing, Peoples R China

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Source :

SOLDERING & SURFACE MOUNT TECHNOLOGY

ISSN: 0954-0911

Year: 2024

Issue: 2

Volume: 37

Page: 150-162

2 . 0 0 0

JCR@2022

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

Affiliated Colleges:

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