A　bendable　electrode　is　an　essential　component　of　flexible　electronics.　The　resistance　stability　against　deformation　is　highly　desired　for　practice.　In　this　work,　a　bendable　Cu　electrode　is　fabricated　by　femtosecond　laser　direct　writing　(FsLDW),　involving　photothermal　reduction　of　Cu　ions　and　deposition　of　Cu　on　polyethylene　terephthalate　(PET)　substrate.　A　highly　conductive　Cu　electrode　with　a　sheet　resistance　of　0.56　Omega　&　sdot;　sq　-　1　is　obtained,　which　is　improved　by　at　least　one　order　of　magnitude　over　previous　works.　It　is　worth　noting　that　the　sheet　resistance　of　the　Cu　electrode　almost　remains　unchanged　after　6000　downward　bending　cycles　at　a　bending　angle　of　30　degrees　and　shows　a　slight　increase　after　10　adhesion　tests,　demonstrating　excellent　bending　stability　and　adhesive　strength.　The　porous　morphology　of　the　deposited　Cu　may　relieve　bending　stress,　resulting　in　high　deformation　resistance.　The　temperature　field　simulation　confirms　sufficient　heat　accumulation　during　FsLDW　for　Cu　ion　reduction　and　PET　surface　melting,　allowing　for　Cu　embedding　on　the　PET　surface　and　improving　adhesion　between　the　Cu　electrode　and　the　substrate.