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Author:

Liu, Yongyong (Liu, Yongyong.) | Wang, Ziqian (Wang, Ziqian.) | Jiang, Xiaoqing (Jiang, Xiaoqing.) | Yuan, Tao (Yuan, Tao.) (Scholars:袁涛)

Indexed by:

EI Scopus SCIE

Abstract:

The formation of brittle intermetallic compounds (IMCs) poses a challenge to Al/Mg dissimilar alloys FSW. The results of the implemented systematic Cu interlayer experiments show that the diffusion forms of elements in the weld nugget zone (WNZ) and banded structure zone (BSZ) varied at different rotation speeds and Cu interlayer thicknesses. Adding Cu interlayer led to the evolution of conventional aluminium-magnesium IMCs towards aluminium-copper, magnesium-copper, and aluminium-copper-magnesium IMCs. The tensile properties of the joints reached the maximum at lower rotation speeds and thinner interlayer thicknesses, respectively, which was attributable to the generation of Al2Cu and Al2CuMg with the best compressive and shear resistance, respectively. Simultaneously, the dispersion distribution of Cu elements and phase transition weakened the stress gradient of BSZ.

Keyword:

intermetallic compounds banded structure zone Cu interlayer stress gradient Al/Mg dissimilar alloys FSW

Author Community:

  • [ 1 ] [Liu, Yongyong]Beihang Univ, R&D Ctr Highefficient & Green CNC Mach Technol & E, Sch Mech Engn & Automat, Beijing, Peoples R China
  • [ 2 ] [Wang, Ziqian]Beijing Univ Technol, Fac Mat & Mfg, Inst Intelligent Forming Equipment & Syst, Beijing 100124, Peoples R China
  • [ 3 ] [Jiang, Xiaoqing]Beijing Univ Technol, Fac Mat & Mfg, Inst Intelligent Forming Equipment & Syst, Beijing 100124, Peoples R China
  • [ 4 ] [Yuan, Tao]Beijing Univ Technol, Fac Mat & Mfg, Inst Intelligent Forming Equipment & Syst, Beijing 100124, Peoples R China

Reprint Author's Address:

  • [Yuan, Tao]Beijing Univ Technol, Fac Mat & Mfg, Inst Intelligent Forming Equipment & Syst, Beijing 100124, Peoples R China;;

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Source :

SCIENCE AND TECHNOLOGY OF WELDING AND JOINING

ISSN: 1362-1718

Year: 2024

Issue: 3

Volume: 29

Page: 202-212

3 . 3 0 0

JCR@2022

Cited Count:

WoS CC Cited Count: 1

SCOPUS Cited Count: 1

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 6

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