The　development　of　miniaturized　and　multifunctional　electronic　products　makes　the　devices　face　problems　such　as　thermal　damage　and　substrate　warpage　during　the　packaging　and　assembly　process.　In　order　to　reduce　the　thermal　impact　of　electronic　packaging　and　assembly　processes　on　chips　and　devices,　low　melting　point　interconnect　materials　need　to　be　researched　and　developed.　Tin-　bismuth　(Sn-Bi)　alloy　solder　has　received　considerable　attention　due　to　its　low　melting　point,　low　cost,　good　wettability　and　mechanical　strength,　but　the　segregation　of　the　brittle　Bi　phase　is　detrimental　to　the　long-　term　service　reliability　of　the　devices.　By　adding　alloying　elements　to　the　Sn-Bi　solder　to　form　a　Sn-xBi-　yM　alloy　solder,　the　service　reliability　of　the　Sn-Bi　alloy　solder　and　its　solder　joints　can　be　effectively　improved.　The　effects　of　different　alloying　elements　on　the　melting　point,　wettability,　microstructure,　mechanical　properties,　interfacial　reaction　and　reliability　of　Sn-　Bi　solder　were　analyzed　and　summarized　from　the　perspective　of　solder　alloying.　And　based　on　the　existing　research　results,　the　future　development　direction　of　Sn-　Bi　alloy　solder　was　prospected.