The　accelerated　application　research　of　power　electronic　devices　intensively　stimulates　the　interconnect　materials　to　catch　the　ability　of　low-temperature　sintering　and　high-temperature　service.　Herein,　the　uniform　micro/nano-hybrid　structure　particles,　which　are　Ag　nanoparticles　decorated　on　the　surface　of　Cu　microparticles　(Cu　MPs@Ag　NPs),　are　fabricated　by　a　mild　one-step　liquid-phase　reduction　method.　XRD　and　TG　analysis　results　demonstrate　Cu　MPs@Ag　NPs　obtain　better　anti-oxidation　than　Cu　MPs,　which　is　caused　by　the　decorated　Ag　NPs.　Meanwhile,　bare　Cu-Cu　bonding　with　Cu　MPs@Ag　NPs　paste　is　achieved　at　200　degrees　C,　250　degrees　C,　and　300　degrees　C　in　the　air.　The　average　strength　of　the　Cu-Cu　joint　reached　29.6　MPa　at　300　degree　celsius.　Additionally,　it　is　found　that　the　fracture　mode　of　the　Cu-Cu　joint　changes　from　brittle　fracture　to　ductile　fracture　when　the　sintering　temperatures　increase.　This　work　demonstrates　the　facilely　synthesized　micro/nano-hybrid　structure　particles　(Cu　MPs@Ag　NPs)　possess　the　potential　application　in　high-power　density　electronic　packaging.