High-precision　bonding　of　flip-mounted　chips　is　the　key　technology　of　advanced　packaging　of　integrated　circuits,　and　the　up-down　camera　technology　currently　used　has　problems　such　as　large　Z-height　difference　and　camera　motion　errors.　In　this　paper,　the　up-down　camera　is　divided　into　two　cameras,　and　a　new　high-precision　flip　chip　alignment　method　is　proposed　by　using　virtual　image　preprocessing　technology,　which　can　greatly　reduce　the　z-direction　motion　stroke　of　the　placement　head　and　reduce　the　accuracy　error.　Aiming　at　the　mechanical　structure　characteristics　of　the　short-range　bidirectional　dislocation　flip　bonding　system,　a　device　for　evaluating　the　alignment　accuracy　is　designed,　which　is　called　the　characteristic　parameter　mask.　Based　on　this　error　evaluation　system,　a　chip　alignment　error　model　is　established,　an　image　virtual　alignment　method　is　proposed,　and　the　alignment　accuracy　of　the　new　method　is　analyzed.　An　optical　alignment　system　was　built　to　correct　the　sub-micron　alignment　mark　for　auto-tuning　to　verify　the　effectiveness　and　reliability　of　the　preprocessing　of　images　acquired　by　the　bidirectional　misalignment　camera.　Experimental　results　show　that　the　proposed　method　can　be　applied　in　high-precision　manual　flip　chip　alignment,　which　can　shorten　the　bonding　distance　to　the　sub-micron　range,　and　the　alignment　accuracy　can　reach　less　than　0.7　microns,　which　meets　the　requirements　of　accuracy,　adaptability　and　real-time　alignment　of　wafer　and　chip　flip　bonding.　©　2024　IEEE.