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Author:

Yang, Xudong (Yang, Xudong.) | Zhang, Jiabao (Zhang, Jiabao.) | Li, Wei (Li, Wei.) | Wang, Haowei (Wang, Haowei.) | Xu, Haoyu (Xu, Haoyu.) | Li, Zhipeng (Li, Zhipeng.) | Cai, Jixiang (Cai, Jixiang.) | Li, Haixin (Li, Haixin.) | Zhang, Jianfei (Zhang, Jianfei.) | Mao, Shengcheng (Mao, Shengcheng.) | Zhang, Ze (Zhang, Ze.) | Han, Xiaodong (Han, Xiaodong.)

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EI Scopus SCIE

Abstract:

The fracture failure mechanism of high-temperature structural materials plays a vital role in the application of high-temperature structural materials. Transmission electron microscopy (TEM) is a unique tool providing the internal microstructures and defects of images in samples with up to atomic resolution. However, great challenges are posed to the realization of atomic-scale observation under thermal-mechanical coupling conditions in TEM. In this work, a thermomechanical testing apparatus combining micro-electro-mechanical system (MEMS) technology with a miniature piezoelectric ceramic inside TEM was developed, which enabled in-situ mechanical testing and high-resolution TEM analysis at elevated temperatures up to 873 K. This unique technique was used to investigate the atomic-scale fracture mechanism of nickel-based superalloy DD6 at high temperatures and stress for the first time. The fracture mode where cracks propagate along the γ and γ′ phase interfaces was proposed. Furthermore, the role of 60° full dislocations at the crack tip in crack propagation was revealed. © 2024 The Authors

Keyword:

Materials testing apparatus High temperature engineering Microchannels Fracture testing Superalloys High resolution transmission electron microscopy High temperature testing Piezoelectric materials Crack tips Crack propagation

Author Community:

  • [ 1 ] [Yang, Xudong]Beijing Key Laboratory of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [Yang, Xudong]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [Zhang, Jiabao]Beijing Key Laboratory of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing; 100124, China
  • [ 4 ] [Li, Wei]Beijing Key Laboratory of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing; 100124, China
  • [ 5 ] [Wang, Haowei]Beijing Key Laboratory of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing; 100124, China
  • [ 6 ] [Xu, Haoyu]Beijing Key Laboratory of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing; 100124, China
  • [ 7 ] [Li, Zhipeng]Beijing Key Laboratory of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing; 100124, China
  • [ 8 ] [Li, Zhipeng]Bestron (Beijing) Science and Technology, Co., Ltd., Beijing; 102600, China
  • [ 9 ] [Cai, Jixiang]Beijing Key Laboratory of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing; 100124, China
  • [ 10 ] [Cai, Jixiang]Bestron (Beijing) Science and Technology, Co., Ltd., Beijing; 102600, China
  • [ 11 ] [Li, Haixin]Beijing Key Laboratory of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing; 100124, China
  • [ 12 ] [Li, Haixin]Bestron (Beijing) Science and Technology, Co., Ltd., Beijing; 102600, China
  • [ 13 ] [Zhang, Jianfei]Beijing Key Laboratory of Multimedia and Intelligent Software Technology, Beijing Artificial Intelligence Institute, Faculty of Information Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 14 ] [Mao, Shengcheng]Beijing Key Laboratory of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing; 100124, China
  • [ 15 ] [Zhang, Ze]Beijing Key Laboratory of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing; 100124, China
  • [ 16 ] [Zhang, Ze]State Key Laboratory of Silicon Materials and Department of Materials Science and Engineering, Zhejiang University, Hangzhou; 310058, China
  • [ 17 ] [Han, Xiaodong]Beijing Key Laboratory of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing; 100124, China

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Source :

Journal of Materials Research and Technology

ISSN: 2238-7854

Year: 2024

Volume: 33

Page: 8967-8973

6 . 4 0 0

JCR@2022

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 11

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