Conventional　tungsten-copper　(W-Cu)　composites　typically　exhibit　a　homogeneous　distribution　of　tungsten　phase.　However,　there　usually　exists　an　trade-off　between　their　mechanical　properties　and　conductivity,　thereby　significantly　limiting　their　potential　applications.　In　this　study,　a　novel　approach　was　proposed　to　concurrently　enhance　the　compressive　strength,　wear　resistance,　and　electrical　conductivity　by　constructing　a　layered　hierarchical　structure　consisting　of　alternating　copper　layers　and　nano　W-Cu　layers.　Compared　with　the　uniform-structured　W-Cu,　it　was　found　that　the　layered　hierarchical　W-Cu　had　an　enhanced　stress　partitioning　of　the　tungsten　phase　and　a　more　concentrated　distribution　of　current　density　in　the　copper　layer.　This　resulted　in　improvements　in　both　strength　and　conductivity.　Furthermore,　the　development　of　a　homogeneous　oxide　mixture　layer　on　the　wear　scar　surface　contributes　to　a　reduction　in　friction　coefficient.　When　combined　with　the　exceptional　strength　of　the　nanostructured　W-Cu　layer,　the　wear　resistance　of　the　layered　hierarchical　W-Cu　was　enhanced.　This　study　highlights　the　pivotal　role　of　multilevel　structural　design　in　development　of　high-performance　bimetallic　composites.　©　2025　Elsevier　Ltd