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Author:

李洪义 (李洪义.) | 温林洁 (温林洁.) | 冉雨畅 (冉雨畅.) | 宋金旭 (宋金旭.) | 王金淑 (王金淑.)

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zhihuiya

Abstract:

一种在高能束焊接钼合金时同步快速渗碳的方法,属于焊接技术领域。包括以下步骤:对钼或钼合金焊接界面进行预处理,在钼或钼合金焊接界面采用磁控溅射技术溅射一层碳薄膜;控制相关参数,采用高能束焊接的方式对处理好的钼或/和钼合金试样进行焊接,即可在高能束焊接钼或/和钼的同时对焊接接头进行快速同步渗碳。完成在高能束焊接的同时达到快速同步渗碳的目的,大大提高钼或/和钼合金接头的力学性能。

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Patent Info :

Type: 发明申请

Patent No.: CN202411030885.X

Filing Date: 2024-07-30

Publication Date: 2024-11-15

Pub. No.: CN118957491A

Applicants: 北京工业大学

Legal Status: 实质审查

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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