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Author:

何存富 (何存富.) | 李金润 (李金润.) | 刘秀成 (刘秀成.)

Indexed by:

zhihuiya

Abstract:

本发明公开了一种基于微磁信号分量解耦的焊接残余应力检测方法,首先,从母材区域、热影响区和焊缝区分别切割取样并进行标定实验,利用实验数据建立微磁信号特征参量值和表面硬度、残余应力的关系曲面方程;其次,面向测得的微磁信号特征参量值,利用寻优算法从关系曲面中反演得到表面硬度和残余应力,其中反演得到的表面硬度沿空间的分布规律需满足过渡函数约束条件;最后,通过逐步递推反演得到焊缝区域的残余应力微磁检测结果。该方法利用过渡函数约束的逐步递推反演过程,将焊接区域材料表面硬度(反映微观组织)和残余应力对微磁信号的影响进行解耦,可实现焊缝周边区域残余应力的微磁定量检测。

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Patent Info :

Type: 发明申请

Patent No.: CN202410361135.4

Filing Date: 2024-03-27

Publication Date: 2024-06-21

Pub. No.: CN118225291A

Applicants: 北京工业大学

Legal Status: 实质审查

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 4

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