Improving　chip　integration　and　computing　power　leads　to　serious　local　overheating　and　high　energy　consumption　in　data　centers.　An　innovative　heat　sink　with　offset　triangular　grooves　is　introduced　to　solve　heat　dissipation　issue　and　improve　energy　efficiency　of　the　cooling　system.　The　flow　boiling　properties　in　the　new　configuration　are　examined　by　visualization　experiment　for　a　flow　rate　of　3　similar　to　15　ml/min　and　heat　flux　of　4.58　similar　to　100.66　W/cm(2).　The　influence　of　groove　arrangement　on　the　flow　evolution,　boiling　curve,　heat　transfer　rate,　pump　power,　coefficient　of　performance,　and　temperature　features　is　explored　in　detail.　The　new　findings　include　that:　compared　to　the　rectangular　microchannel,　the　offset　grooves　induce　boiling　with　a　16.8　degrees　C　lower　temperature　and　10.52　times　higher　heat　transport　efficiency,　attributing　to　the　increased　nucleation　sites　and　enhanced　liquid　film　vaporization.　For　low　heat　flux,　the　heat　transport　rate　of　offset　grooves　is　2.87　times　larger　than　the　symmetrical　one　because　of　the　efficient　steam　removal.　For　high　heat　flux,　the　symmetrical　grooves　present　superior　thermal　performance　due　to　stronger　flow　disturbance.　Moreover,　the　pump　power　for　the　offset　grooves　is　dropped　by　71.47　%　and　14.23　%　compared　to　the　smooth　one　and　symmetrical　counterpart,　respectively.　The　temperature　stability　and　uniformity　of　the　offset　grooves　are　also　better　than　those　of　other　heat　sinks.　The　effect　of　groove　arrangement　on　the　flow　boiling　features　is　revealed　thoroughly,　and　the　optimal　configuration　under　different　operating　conditions　is　obtained.　The　innovative　configuration　achieves　heat　dissipation　enhancement　while　reducing　pump　power　with　a　significantly　improved　coefficient　of　performance.　In　addition,　the　interaction　between　flow　evolution　and　heat　transfer　is　elucidated　by　bubble　dynamics　analysis.　The　new　design　has　a　better　application　prospect　for　chip-scale　cooling　in　data　centers　because　of　the　improved　boiling　stability,　increased　heat　transport　efficiency,　reduced　pump　power,　and　favorable　temperature　performance.