This　study　systematically　investigates　the　deformation　behavior　of　Ni,　Ni5W,　and　Ni9W　alloys　during　tensile　testing　accompanied　by　electron　backscatter　diffraction　(EBSD)　analysis.　During　the　plastic　deformation　stage,　the　loss　of　EBSD　signals　at　grain　boundaries　is　significantly　influenced　by　the　direction　of　tensile　loading.　Grain　boundaries　perpendicular　to　the　tensile　direction　are　prone　to　strain　localization　but　do　not　typically　result　in　the　loss　of　EBSD　signals.　In　contrast,　grain　boundaries　parallel　to　the　tensile　direction　frequently　show　EBSD　signal　loss.　Further　analysis　indicates　that,　with　increasing　deformation,　the　grain　behavior　in　Ni,　Ni5W,　and　Ni9W　samples　diverges　into　two　main　trends:　one　trend　involves　grains　rotating　towards　a　low　Schmid　factor　orientation,　which　effectively　resists　dislocation　slip　and　results　in　the　formation　of　specific　texture;　the　other　trend　maintains　a　high　Schmid　factor　orientation,　aligns　with　dislocation　slip,　and　leads　to　texture　evolution.　In　summary,　this　study　enhances　the　understanding　of　the　tensile　deformation　in　face-centered　cubic　(FCC)　metals,　providing　a　theoretical　foundation　for　optimizing　the　mechanical　properties　of　metallic　materials.