Sintered　silver　paste　has　emerged　as　one　of　the　most　promising　green　packaging　interconnection　materials　in　electronic　packaging　due　to　its　combination　of　low-temperature　processing　and　high-temperature　service　capabilities.　At　the　microscale,　sintered　silver　exhibits　random　porous　structures　influenced　by　sintering　processes,　leading　to　various　fracture　issues　under　complex　operating　conditions,　where　the　mechanical　reliability　is　significantly　influenced　by　thermo-mechanical　loading　during　service.　This　study　establishes　a　thermo-mechanical　coupled　phase-field　model　incorporating　mixed　tensile-shear　failure　modes　to　investigate　the　mechanical　behavior　and　fracture　evolution　of　random　porous　structures　reconstructed　from　SEM　images　of　sintered　silver.　The　phase-field　approach　effectively　captures　crack　initiation　and　propagation　without　explicit　crack　tracking　by　introducing　a　regularized　description　of　discontinuities.　Numerical　predictions　of　elastic　modulus　and　tensile　strength　show　good　agreement　with　experimental　results　under　various　loading　conditions,　including　tensile,　shear,　and　end-　notched　flexure　(ENF)　tests.　Simulations　of　crack　propagation　under　thermal　and　shear　loading　conditions　reveal　distinctive　crack　patterns　and　complex　crack　networks.　The　proposed　approach　provides　an　efficient　and　reliable　method　for　simulating　the　mechanical　behavior　and　failure　mechanisms　of　sintered　silver　solder　with　random　porous　structures,　offering　valuable　insights　for　improving　electronic　package　reliability.