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Author:

Dai, Yanwei (Dai, Yanwei.) (Scholars:代岩伟) | Liu, Yinghua (Liu, Yinghua.) | Chen, Haofeng (Chen, Haofeng.)

Indexed by:

EI Scopus SCIE

Abstract:

The effects of T-stress on the stress field, creep zone and constraint effect of the mode I crack tip in power-law creeping solids are presented based on finite element (FE) analysis in the paper. The characteristics of the crack tip field in power-law creep solids by considering low negative T-stress and high positive T-stress are studied in the paper. The differences of T-stress effect on the crack tip field between power-law creeping solids and elastoplastic materials are also clarified. A modified parameter is proposed to characterize the influence of T-stress on creep zone. The constraint parameter Q under both small-scale creep and large-scale creep with various T-stresses for the modified boundary layer (MBL) model and various specimens with different crack depths are given. The applicability and the limitation of the MBL model for creep crack are also investigated. The inherent connection between T-stress and Q-parameter is discussed. The investigations given in this paper can further promote the understanding of T-stress effect and constraint effect on the mode I creep crack.

Keyword:

creep zone T-stress power-law creep constraint effect finite element method

Author Community:

  • [ 1 ] [Dai, Yanwei]Tsinghua Univ, Dept Engn Mech, AML, Beijing 100084, Peoples R China
  • [ 2 ] [Liu, Yinghua]Tsinghua Univ, Dept Engn Mech, AML, Beijing 100084, Peoples R China
  • [ 3 ] [Dai, Yanwei]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100022, Peoples R China
  • [ 4 ] [Chen, Haofeng]Univ Strathclyde, Dept Mech & Aerosp Engn, James Weir Bldg,75 Montrose St, Glasgow G1 1XJ, Lanark, Scotland

Reprint Author's Address:

  • [Liu, Yinghua]Tsinghua Univ, Dept Engn Mech, AML, Beijing 100084, Peoples R China

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Source :

INTERNATIONAL JOURNAL OF COMPUTATIONAL METHODS

ISSN: 0219-8762

Year: 2019

Issue: 8

Volume: 16

1 . 7 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:136

JCR Journal Grade:2

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 2

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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