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Author:

Zheng, Gangfeng (Zheng, Gangfeng.) | Wu, Bin (Wu, Bin.) | He, Cunfu (He, Cunfu.) (Scholars:何存富)

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EI Scopus

Abstract:

In this article, three dimensional Born inverse scattering method is modified to convenient form (Born inversion technique) to reconstruct the shape of a three-dimensional flaw in a cylindrical specimen. In this technique, a measurement plane is restricted to the plane perpendicular to the axis of the cylindrical specimen. Thus the cross-sectional image of the flaw can be obtained. By moving the measurement plane along the axis of the cylindrical specimen, the cross-sectional image is obtained for each measurement plane. The three-dimensional flaw image is reconstructed by piling up the obtained cross-sectional images. Cylindrical specimen with an eccentric circular cylindrical cavity model is prepared. The performance of Born inversion technique to reconstruct the three-dimensional flaw is proved by using the experimentally measured waveforms. At the same time, the numerical results are obtained from all directions by finite element method. From the numerical analysis and experimental research for the eccentric circular cylindrical defect, it can be said that the modified method is an effective mean of shape reconstruction and it can reconstruct an eccentric defect that has a characteristic size of 4 mm. It is also proved that Born inversion technique works well for the volume type flaw. © 2013 Asian Network for Scientific Information.

Keyword:

Numerical analysis Bars (metal) Ultrasonic scattering Numerical methods Defects Ultrasonic applications Scattering Inverse problems

Author Community:

  • [ 1 ] [Zheng, Gangfeng]College of Materials Science and Engineering, Anhui University of Science and Technology, 232001, Huainan, China
  • [ 2 ] [Wu, Bin]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, 100022, Beijing, China
  • [ 3 ] [He, Cunfu]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, 100022, Beijing, China

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Source :

Journal of Applied Sciences

ISSN: 1812-5654

Year: 2013

Issue: 21

Volume: 13

Page: 4399-4404

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 8

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