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Author:

Jiao, Jingpin (Jiao, Jingpin.) (Scholars:焦敬品) | Zeng, Xianchao (Zeng, Xianchao.) | Zhang, Qiang (Zhang, Qiang.) | He, Cunfu (He, Cunfu.) (Scholars:何存富) | Wu, Bin (Wu, Bin.)

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EI Scopus PKU CSCD

Abstract:

A micromechanical model of rough surface for an interface between two solids is presented to evaluate the acoustic properties during loading and unloading cycle. By theoretical description of the micromechanics of rough, contacting surfaces under static normal loads, the relationship between the topographic parameters of the rough surface and the acoustic response of pressure interface are established. Ultrasonic experiments are performed on three different interfaces formed by aluminum surfaces with different levels of roughness. The ultrasonic transmission coefficient from the interface is measured during loading and unloading cycles as a function of pressure, from which the ultrasonic interfacial contact stiffness and nonlinear coefficient are obtained. It is shown that the nonlinear coefficient is more sensitive to contact variation of interface under low loads. The topographic parameters of interface parameters are obtained by fitting measured transmission coefficients using nonlinear least squared minimization method. Using obtained parameters, the acoustic properties of interface are calculated. The theoretical acoustic properties are agreed well with the experimental results, and it is demonstrating the capability of the micromechanical model of rough surface in predicting the ultrasonic responses of imperfect interfaces. © 2011 Journal of Mechanical Engineering.

Keyword:

Stiffness Acoustic properties Unloading Surface measurement

Author Community:

  • [ 1 ] [Jiao, Jingpin]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
  • [ 2 ] [Zeng, Xianchao]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
  • [ 3 ] [Zhang, Qiang]China Machinery Information Institute, Beijing 100037, China
  • [ 4 ] [He, Cunfu]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
  • [ 5 ] [Wu, Bin]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

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Source :

Journal of Mechanical Engineering

ISSN: 0577-6686

Year: 2011

Issue: 17

Volume: 47

Page: 78-83

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 10

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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