• Complex
  • Title
  • Keyword
  • Abstract
  • Scholars
  • Journal
  • ISSN
  • Conference
搜索

Author:

Wang, Ying-Ling (Wang, Ying-Ling.) | Li, Hong (Li, Hong.) | Li, Zhuo-Xin (Li, Zhuo-Xin.) | Feng, Ji-Cai (Feng, Ji-Cai.)

Indexed by:

EI Scopus PKU CSCD

Abstract:

Transient liquid phase diffusion bonding (TLP-DB) of TiNi shape memory alloy (SMA) to stainless steel was performed with AgCu foil as interlayer. The effect of bonding temperature, holding time and bonding pressure was also investigated. The results showed that the maximum shear strength of the joint was obtained for the specimens joined at 860C for 60 minutes with a specific pressure of 0.05 MPa. Through scanning electron microscopy (SEM) and X-ray diffractometry (XRD) test, the element distribution and phase composition of the joint welded under the optimum process parameters were investigated. It indicated that the joint property was significantly influenced by the formation of intermetallics TiNi2, TiFe and Ti3Ni4 etc.

Keyword:

Shear strength Liquids X ray diffraction analysis Titanium alloys Diffusion Silver alloys Titanium metallography Shape-memory alloy Copper metallography Diffusion bonding Binary alloys Scanning electron microscopy Welds Nickel metallography Silver metallography Stainless steel Iron metallography Nickel steel Copper alloys

Author Community:

  • [ 1 ] [Wang, Ying-Ling]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
  • [ 2 ] [Li, Hong]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
  • [ 3 ] [Li, Zhuo-Xin]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
  • [ 4 ] [Li, Zhuo-Xin]State Key Lab. of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China
  • [ 5 ] [Feng, Ji-Cai]State Key Lab. of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China

Reprint Author's Address:

Show more details

Related Keywords:

Source :

Journal of Materials Engineering

ISSN: 1001-4381

Year: 2008

Issue: 9

Page: 48-51,55

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 10

Online/Total:470/10557620
Address:BJUT Library(100 Pingleyuan,Chaoyang District,Beijing 100124, China Post Code:100124) Contact Us:010-67392185
Copyright:BJUT Library Technical Support:Beijing Aegean Software Co., Ltd.