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Author:

Liao, Wang-Wei (Liao, Wang-Wei.) | Yang, Lei (Yang, Lei.) | Chen, Jie (Chen, Jie.) | Zhou, Da-Li (Zhou, Da-Li.) | Qu, Xian-lin (Qu, Xian-lin.) | Zheng, Kun (Zheng, Kun.) (Scholars:郑坤) | Han, Guang (Han, Guang.) | Zhou, Jia-Bei (Zhou, Jia-Bei.) | Hong, Min (Hong, Min.) | Chen, Zhi-Gang (Chen, Zhi-Gang.)

Indexed by:

EI Scopus SCIE

Abstract:

Copper selenide (Cu2Se) has been extensively studied as an eco-friendly thermoelectric candidate owing to the outstanding thermoelectric performance of its high-temperature beta-phase. In this study, we propose that alpha-Cu2Se is also a promising thermoelectric material at near-room-temperature. We synthesize nanostructured Cu2-xSe via a facile solvothermal method, and densify the samples using Spark Plasma Sintering to maintain the small grain sizes. Although the as-prepared alpha-Cu2Se has intrinsically low lattice thermal conductivity, its high Cu deficiency leads to a high carrier concentration, therefore, a low thermoelectric performance. As an electron donor, bismuth can effectively compress the Cu vacancies of the as-prepared alpha-Cu2Se and in turn reduce its carrier concentration from 4.1 x 10(20) to 2.0 x 10(20) cm(-3) at room temperature, achieving a significantly enhanced power factor and a reduced carrier thermal conductivity. Consequently, a zT of 0.43 at 373 K is obtained in Cu1.982Bi0.006Se, showing great potential in developing high-performance near-room-temperature alpha-Cu2Se-based thermoelectric materials.

Keyword:

Copper selenide Near-room-temperature alpha-Phase Thermoelectric

Author Community:

  • [ 1 ] [Liao, Wang-Wei]Sichuan Univ, Sch Mat Sci & Engn, Chengdu 610064, Sichuan, Peoples R China
  • [ 2 ] [Yang, Lei]Sichuan Univ, Sch Mat Sci & Engn, Chengdu 610064, Sichuan, Peoples R China
  • [ 3 ] [Chen, Jie]Sichuan Univ, Sch Mat Sci & Engn, Chengdu 610064, Sichuan, Peoples R China
  • [ 4 ] [Zhou, Da-Li]Sichuan Univ, Sch Mat Sci & Engn, Chengdu 610064, Sichuan, Peoples R China
  • [ 5 ] [Qu, Xian-lin]Beijing Univ Technol, Inst Microstruct & Properties Adv Mat, Beijing 100022, Peoples R China
  • [ 6 ] [Zheng, Kun]Beijing Univ Technol, Inst Microstruct & Properties Adv Mat, Beijing 100022, Peoples R China
  • [ 7 ] [Han, Guang]Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China
  • [ 8 ] [Zhou, Jia-Bei]Sichuan Univ, Sch Chem Engn, Chengdu 610064, Sichuan, Peoples R China
  • [ 9 ] [Hong, Min]Univ Southern Queensland, Ctr Future Mat, Springfield Cent, Qld 4300, Australia
  • [ 10 ] [Chen, Zhi-Gang]Univ Southern Queensland, Ctr Future Mat, Springfield Cent, Qld 4300, Australia
  • [ 11 ] [Chen, Zhi-Gang]Univ Queensland, Mat Engn, St Lucia, Qld 4072, Australia

Reprint Author's Address:

  • [Yang, Lei]Univ Southern Queensland, Ctr Future Mat, Springfield Cent, Qld 4300, Australia;;[Zhou, Da-Li]Univ Southern Queensland, Ctr Future Mat, Springfield Cent, Qld 4300, Australia;;[Chen, Zhi-Gang]Univ Southern Queensland, Ctr Future Mat, Springfield Cent, Qld 4300, Australia

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Source :

CHEMICAL ENGINEERING JOURNAL

ISSN: 1385-8947

Year: 2019

Volume: 371

Page: 593-599

1 5 . 1 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:136

JCR Journal Grade:1

Cited Count:

WoS CC Cited Count: 50

SCOPUS Cited Count: 52

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 12

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