The　paper　mainly　studies　the　reliability　of　multi-layer　interconnections,　viae　and　thick-film　resistors　in　Multi-chip　Module-Ceramic　(MCM-C)　substrates.　Temperature　stress　and　voltage　stress　are　used　to　accelerate　the　life　test.　The　results　show　that　when　the　temperature　is　under　180°C,　the　failure　of　metal　lines　plays　a　much　more　important　role　than　the　failure　of　film　resistors;　but　when　it＇s　over　180°C,　the　failure　of　film　resistors　will　also　be　important.　The　paper　also　calculated　the　lifetime　and　accelerating　coefficient　of　metal　lines　and　thick-film　resistors.