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Author:

Cheng, Qiang (Cheng, Qiang.) (Scholars:程强) | Yan, Guobin (Yan, Guobin.) | Li, Guangpeng (Li, Guangpeng.) | Sun, Bingwei (Sun, Bingwei.) | Li, Weishuo (Li, Weishuo.) | Qi, Baobao (Qi, Baobao.)

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EI Scopus

Abstract:

Thermal error is the key error source which affects the stability of machining accuracy and temperature measurement point optimization is the premise and difficult to achieve accurate thermal error compensation. In order to reduce the temperature measurement point and improve the efficiency of temperature data acquisition, The method is proposed based on principal component analysis (PCA) and Single Variable Contribution (SVC). This method is mainly to reduce the temperature measurement points of the machine tool, so as to facilitate the later thermal error modelling. firstly, PCA is introduced to extract the principal components of temperature data samples. Then, the contribution of each temperature variable attribute in the main component space is recorded as a single variable contribution degree, and based on which the key measuring points is screened out. Thirdly, multivariable linear regression model is used as the thermal error model of the spindle in z-axix. Finally, three axis CNC machine tool Hl000/3v is taken as the research object and the results show that the proposed method can reduce the temperature measuring point from 24 to 6, and minimum residual error is only 0.5 11 m. This fully shows that the method proposed in this paper is effective, and has a certain guiding role to improve the precision prediction of machine tool. © 2017 IEEE.

Keyword:

Error compensation Computer control systems Temperature measurement Support vector machines Machine tools Static Var compensators Regression analysis Machining Data acquisition Multivariable systems

Author Community:

  • [ 1 ] [Cheng, Qiang]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [Yan, Guobin]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [Li, Guangpeng]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 4 ] [Sun, Bingwei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 5 ] [Li, Weishuo]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 6 ] [Qi, Baobao]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China

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Year: 2017

Volume: 2017-January

Page: 942-947

Language: English

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 8

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