Simplified empirical formula on TSV thermal analysis for 3D IC EDA - Details

Author：

Lu, Bo (Lu, Bo.) | Hou, Ligang (Hou, Ligang.) | Fu, Jingyan (Fu, Jingyan.) | Wang, Jinhui (Wang, Jinhui.)

Indexed by：

EI Scopus

Abstract：

In　this　paper,　based　on　the　formulas　of　the　classic　theory　of　heat　conduction,　proposed　a　temperature　distribution　formula　in　the　three-dimensional　space,　which　can　effectively　and　accurately　calculated　the　temperature　value　at　any　coordinate-point　within　the　TSV(Through　Silicon　Via)　model.　By　simulating　the　behavior　of　heat　conduction　and　analyzing　temperature　data,　this　paper　proposed　the　simplified　empirical　formula　of　temperature　distribution　for　analyzing　in　3D　IC,　and　compared　the　calculated　value　with　the　simulation　value　to　validate.　These　results　will　be　easy　to　estimate　the　range　of　temperature　change　for　EDA　toll.　©　2014　IEEE.

Keyword：

Timing circuits Thermoanalysis Temperature distribution Heat conduction Three dimensional integrated circuits Electronics packaging

Author Community：

[ 1 ] [Lu, Bo]Integrated Circuits and System Integration of Sciences, Beijing University of Technology, Beijing; 100124, China
[ 2 ] [Hou, Ligang]Integrated Circuits and System Integration of Sciences, Beijing University of Technology, Beijing; 100124, China
[ 3 ] [Fu, Jingyan]Integrated Circuits and System Integration of Sciences, Beijing University of Technology, Beijing; 100124, China
[ 4 ] [Wang, Jinhui]Integrated Circuits and System Integration of Sciences, Beijing University of Technology, Beijing; 100124, China

Reprint Author's Address：

[hou, ligang]integrated circuits and system integration of sciences, beijing university of technology, beijing; 100124, china

Email：

houligang@bjut.edu.cn

Show more details

Related Keywords：

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Source ：

Year： 2014

Language： English

Cited Count：

WoS CC Cited Count：

SCOPUS Cited Count： 3

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 5

Affiliated Colleges：

学院待认领

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