Signal integrity aware TSV positioning - Details

Author：

Hou, Ligang (Hou, Ligang.) | Bai, Shu (Bai, Shu.) | Wang, Jinhui (Wang, Jinhui.) | Peng, Xiaohong (Peng, Xiaohong.) | Geng, Shuqin (Geng, Shuqin.)

Indexed by：

EI Scopus

Abstract：

In　this　paper,　a　signal　integrity　aware　TSV　positioning　method　(SITP)　is　introduced.　Grounded　TSV　proved　to　help　eliminating　TSV-to-TSV　coupling.　A　trench　based　3D　IC　placement　method　is　developed,　transforming　2D　placement　into　3D　placement　and　perform　signal　TSV　placement　with　flexible　grounded　TSV　Insertion.　IBM　placement　benchmark　is　used　for　original　2D　placement.　By　evaluating　wire-length　and　runtime,　SITP　automatically　achieve　high　performance　3D　IC　placement　with　considerable　TSV-TSV　interference　elimination.　©　2012　IEEE.

Keyword：

Three dimensional integrated circuits Busbars Electromagnetic compatibility

Author Community：

[ 1 ] [Hou, Ligang]VLSI and System Lab., Beijing University of Technology, 425 Mailbox, No.100 PingLeYuan, Beijing, China
[ 2 ] [Bai, Shu]VLSI and System Lab., Beijing University of Technology, 425 Mailbox, No.100 PingLeYuan, Beijing, China
[ 3 ] [Wang, Jinhui]VLSI and System Lab., Beijing University of Technology, 425 Mailbox, No.100 PingLeYuan, Beijing, China
[ 4 ] [Peng, Xiaohong]VLSI and System Lab., Beijing University of Technology, 425 Mailbox, No.100 PingLeYuan, Beijing, China
[ 5 ] [Geng, Shuqin]VLSI and System Lab., Beijing University of Technology, 425 Mailbox, No.100 PingLeYuan, Beijing, China

Reprint Author's Address：

Email：

houligang@bjut.edu.cn

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Source ：

Year： 2012

Page： 825-828

Language： English

Cited Count：

WoS CC Cited Count：

SCOPUS Cited Count： 1

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 0

Affiliated Colleges：

信息科学技术学院本学院/部未明确归属的数据

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