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Author:

He, Cunfu (He, Cunfu.) (Scholars:何存富) | Yuan, Hongmei (Yuan, Hongmei.) | Wu, Bin (Wu, Bin.)

Indexed by:

EI Scopus

Abstract:

Defects in the seal area of flexible packages bring out health hazards and economic loss. The ultrasonic Backscattered Echo Envelope Integral (BEEI) imaging technique has been used to detect the seal integrity of hermetically sealed flexible packages. This technique was able to reliably inspect channel defects as small as 50μm in diameter in the seal area of flexible packages. The study of experimental spatial sampling for the BEEI-mode imaging technique was presented. Channel defects ranging from 50 to 150μm in diameter embedded in bonded 2-sheet polyethylene film were used for sample. An immersion spherically focused transducer (center frequency of 22.66 MHz) scanned over sample with a static rectilinear stop-and-go scanning pattern and acquired echo data in varying scanning step from each sample. Two descriptors, the average BEEI value difference (ΔBEEI) between defected and intact regions and contrast-to-noise ratio (CNR), were defined to quantitatively assess the BEEI-mode image quality versus varying scanning step size and varying sized defects. For any given defects, the ΔBEEI and CNR degraded as scanning step size increased. Detailed imaging of defects can be acquired when the step size is small than echo focal beam diameter, and the image become partial or completely distorted when the step size exceeds twice of the beam diameter. © 2009 SPIE.

Keyword:

Packaging Packaging machines Nondestructive examination Losses Ultrasonic testing Defects Scanning Imaging techniques Health hazards

Author Community:

  • [ 1 ] [He, Cunfu]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 2 ] [Yuan, Hongmei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 3 ] [Wu, Bin]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China

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ISSN: 0277-786X

Year: 2009

Volume: 7375

Language: English

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 6

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