High speed deformation measurement of electronic packages by the digital image correlation method - Details

Author：

Li, Jiangang (Li, Jiangang.) | Qin, Fei (Qin, Fei.) (Scholars：秦飞) | An, Tong (An, Tong.) | Jin, Ling (Jin, Ling.)

Indexed by：

EI Scopus

Abstract：

4-point　dynamic　bending　tests　of　board　level　electronics　packages　were　carried　out　in　order　to　investigate　the　reliability　of　solder　joints.　A　high　speed　camera　and　the　digital　image　correlation　method　were　used　to　measure　the　deflection　of　the　PCB　board.　A　finite　element　model　to　simulate　the　test　was　built　up　and　was　validated　by　the　test　data.　©　2009　SPIE.

Keyword：

Bending tests Correlation methods Printed circuit boards Finite element method High speed cameras Strain measurement Dynamics Image analysis

Author Community：

[ 1 ] [Li, Jiangang]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Qin, Fei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 3 ] [An, Tong]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 4 ] [Jin, Ling]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

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Related Keywords：

Experimental and numerical study of board level electronics package with dynamic bending
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Source ：

ISSN： 0277-786X

Year： 2009

Volume： 7375

Language： English

Cited Count：

WoS CC Cited Count： 0

SCOPUS Cited Count： 2

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 6

Affiliated Colleges：

材料科学与工程学院本学院/部未明确归属的数据

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